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STPCE1EDBC

STMicroelectronics

STPCE1EDBC by STMicroelectronics

STPCE1EDBC by STMicroelectronics is a multi-functional peripheral with 32-bit address and external data bus width. It operates at 2.25-2.75 V, supports PCI and ISA bus compatibility, and has a max clock frequency of 14.318 MHz. Ideal for applications requiring high-speed data processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,291

-

-

-

-

Vyrian

USA . 1,442 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,442

-

-

-

-

Anansix

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

358

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 44 parts In-Stock

1+ parts

$39.547

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$39.547

-

-

-

IDEA Electronic Components Group

UK . 275 parts In-Stock

1+ parts

$52.284

100+ parts

-

1k+ parts

$47.055

10k+ parts

-

275

$52.284

-

$47.055

-

MKK Technologies

India . 1,589 parts In-Stock

1+ parts

$98.316

100+ parts

-

1k+ parts

-

10k+ parts

-

1,589

$98.316

-

-

-

DigiPath Technology Company

USA . 1,589 parts In-Stock

1+ parts

$98.316

100+ parts

-

1k+ parts

-

10k+ parts

-

1,589

$98.316

-

-

-

Corphita

USA . 3,568 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,568

-

-

-

-

Parana Technologies

USA . 1,587 parts In-Stock

1+ parts

-

100+ parts

$62.513

1k+ parts

-

10k+ parts

-

1,587

-

$62.513

-

-

Overview

Unlock the full potential of your electronic devices with the STPCE1EDBC by STMicroelectronics. Crafted with precision and expertise, this multi-functional peripheral offers unparalleled quality and reliability. From enhancing performance to enabling seamless connectivity, this product is a game-changer in its category. Whether you're a tech enthusiast or a professional, the STPCE1EDBC delivers unmatched value, benefits, and advantages to optimize your experience. Upgrade your devices today with this cutting-edge solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for regular use.

Surface Mount: YES

The surface mount feature allows for easy installation and replacement of the product on compatible surfaces or circuit boards.

Maximum Supply Voltage: 2.75 V

The high maximum supply voltage ensures stable and consistent performance, reducing the risk of voltage fluctuations affecting the product.

Address Bus Width: 32

The wide address bus width of 32 allows for efficient data transfer and processing, improving overall performance.

Package Shape: SQUARE

The square package shape offers a compact design, saving space and making it easier to integrate the product into various systems.

No. of Terminals: 388

The large number of terminals provide ample connectivity options, supporting versatile use and compatibility with different devices.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures that the product can operate efficiently even in low-power environments or conditions.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy and secure connection with external devices or circuitry.

Maximum Seated Height: 2.38 mm

The low maximum seated height allows for slim and compact installation, ideal for applications where space is limited.

Width: 35 mm

The moderate width of 35mm strikes a balance between compact size and adequate surface area for components and connectivity.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the product during manufacturing or troubleshooting processes.

External Data Bus Width: 32

The external data bus width of 32 enhances data transfer speed and performance, ensuring smooth operation for various applications.

Maximum Clock Frequency: 14.318 MHz

The high maximum clock frequency supports fast data processing and response times, making the product suitable for demanding tasks.

Length: 35 mm

The length of 35 mm complements the width and seated height, providing a well-balanced form factor for the product.

Technology: CMOS

The CMOS technology offers efficient power consumption and high-speed operation, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, reducing the risk of disconnections or signal interference.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V is a standard and stable power requirement, ensuring compatibility with most power sources.

Bus Compatibility: PCI; ISA

The bus compatibility with PCI and ISA interfaces allows for seamless integration with a wide range of systems and devices.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm enables high-density packaging and connectivity, making the product suitable for compact designs.

Technical Specifications

Multi-functional Peripherals STPCE1EDBC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

-40 TO 115 C OPERATING CASE TEMPERATURE

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCE1EDBC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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