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STPCC4HEBC

STMicroelectronics

STPCC4HEBC by STMicroelectronics

STPCC4HEBC by STMicroelectronics is a multifunction peripheral IC with a max supply voltage of 2.7V and operates at temperatures from 0 °C to 85°C. It features a 32-bit address bus and supports PCI/ISA bus compatibility. Ideal for compact applications, it comes in a square grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,277 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,277

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Digiode

USA . 924 parts In-Stock

1+ parts

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1k+ parts

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924

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Vyrian

USA . 778 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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778

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,226 parts In-Stock

1+ parts

$28.258

100+ parts

-

1k+ parts

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10k+ parts

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3,226

$28.258

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IDEA Electronic Components Group

UK . 776 parts In-Stock

1+ parts

$74.456

100+ parts

-

1k+ parts

$67.010

10k+ parts

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776

$74.456

-

$67.010

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MKK Technologies

India . 1,232 parts In-Stock

1+ parts

$140.009

100+ parts

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1,232

$140.009

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DigiPath Technology Company

USA . 1,232 parts In-Stock

1+ parts

$140.009

100+ parts

-

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1,232

$140.009

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Corphita

USA . 1,749 parts In-Stock

1+ parts

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1,749

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Parana Technologies

USA . 128 parts In-Stock

1+ parts

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100+ parts

$89.023

1k+ parts

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128

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$89.023

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Overview

Experience unparalleled performance with the STPCC4HEBC from STMicroelectronics, a leader in innovation and quality. This versatile multi-functional peripheral enhances your designs with superior reliability and efficiency. Ideal for a range of applications, it ensures seamless integration while operating within a wide temperature range. Trust in STMicroelectronics’ renowned expertise to deliver exceptional value, empowering you to elevate your projects and achieve outstanding results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic and epoxy combination ensures robustness and longevity, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, ideal for modern electronics.

Maximum Supply Voltage: 2.7 V

With a maximum supply voltage of 2.7 V, this product can operate efficiently while ensuring safety in sensitive applications.

Address Bus Width: 32

A 32-bit address bus width allows for a large memory addressing capability, enhancing the performance in data-intensive applications.

Package Shape: SQUARE

The square package shape optimizes space on circuit boards and facilitates easier integration into various designs.

Power Supplies (V): 3.3

Operating at 3.3 V provides compatibility with a wide range of modern electronic components, ensuring versatile integration.

No. of Terminals: 388

A high number of terminals means increased connectivity options, enabling a diverse range of functionalities and peripherals.

Package Style (Meter): GRID ARRAY

The grid array style supports high-density mounting, essential for compact and efficient electronic designs.

Minimum Supply Voltage: 2.45 V

With a minimum supply voltage of 2.45 V, the product maintains functionality in lower power scenarios, improving energy efficiency.

Maximum Operating Temperature: 85 °C

An extended temperature range ensures reliable operation in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Operational capability from 0 °C ensures functionality in standard environments, adding to its versatility.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: BOTTOM

Bottom-terminal positioning allows for effective heat dissipation and optimized design layouts in printed circuit boards.

Maximum Seated Height: 2.38 mm

A low seated height contributes to the overall compactness of the device, facilitating integration into space-constrained applications.

Width: 35 mm

A manageable width of 35 mm makes it suitable for various device designs, enhancing compatibility with existing systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the system, streamlining production and maintenance processes.

External Data Bus Width: 32

A 32-bit external data bus width enables high-speed data transfer, improving overall system performance.

Maximum Clock Frequency: 14.318 MHz

With a maximum clock frequency of 14.318 MHz, the product supports fast operations, suitable for demanding applications.

Length: 35 mm

A length of 35 mm provides a balanced form factor, fitting well in various multi-functional peripheral devices.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Being a multifunction peripheral type allows integration of multiple functionalities into a single chip, saving space and reducing cost.

Technology: CMOS

CMOS technology offers low power consumption and high-density integration, enhancing battery-operated applications' efficiency.

Terminal Form: BALL

Ball terminal form enhances soldering efficiency and reliability, critical for high-volume manufacturing.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V allows it to operate efficiently in low-power environments, favoring energy-conscious designs.

Bus Compatibility: PCI; ISA

Compatibility with both PCI and ISA buses ensures broad applicability and ease of integration into various systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between connectivity density and manufacturability, making it ideal for compact designs.

Technical Specifications

Multi-functional Peripherals STPCC4HEBC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Multifunction Peripherals

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCC4HEBC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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