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STPCC4EEBI

STMicroelectronics

STPCC4EEBI by STMicroelectronics

STPCC4EEBI by STMicroelectronics is a multi-functional peripheral with 32-bit address and external data bus width. It operates at a max clock frequency of 14.318 MHz, suitable for PCI and ISA bus compatibility applications. The package style is grid array with 388 terminals in a square shape, making it ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,611 parts In-Stock

1+ parts

-

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2,611

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Vyrian

USA . 1,522 parts In-Stock

1+ parts

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-

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1,522

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Anansix

USA . 163 parts In-Stock

1+ parts

-

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163

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 10 parts In-Stock

1+ parts

$44.192

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$44.192

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-

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

1+ parts

$56.195

100+ parts

-

1k+ parts

$50.575

10k+ parts

-

1,793

$56.195

-

$50.575

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MKK Technologies

India . 1,772 parts In-Stock

1+ parts

$105.670

100+ parts

-

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1,772

$105.670

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DigiPath Technology Company

USA . 1,772 parts In-Stock

1+ parts

$105.670

100+ parts

-

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10k+ parts

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1,772

$105.670

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Corphita

USA . 4,829 parts In-Stock

1+ parts

-

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4,829

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Parana Technologies

USA . 347 parts In-Stock

1+ parts

-

100+ parts

$67.189

1k+ parts

-

10k+ parts

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347

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$67.189

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Overview

Elevate your electronics projects to the next level with the STPCC4EEBI by STMicroelectronics. Crafted with precision and reliability in mind, this multi-functional peripheral offers unparalleled versatility and performance. Whether you're a seasoned professional or an aspiring hobbyist, this product's cutting-edge technology and innovative design ensure seamless integration and superior functionality. Experience the difference of quality engineering and unlock endless possibilities with the STPCC4EEBI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product durable and lightweight, ideal for portable multi-functional peripherals.

Maximum Supply Voltage: 2.7 V

The high maximum supply voltage allows for efficient power management and ensures stable performance under various operating conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of devices.

Maximum Clock Frequency: 14.318 MHz

With a high maximum clock frequency, this multi-functional peripheral can process data quickly and efficiently, increasing productivity.

Bus Compatibility: PCI; ISA

The compatibility with PCI and ISA buses allows this product to be easily integrated into existing computer systems, making it a versatile choice for various applications.

Technical Specifications

Multi-functional Peripherals STPCC4EEBI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

-40 TO 115 C OPERATING CASE TEMPERATURE

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCC4EEBI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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