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STPCI2GDYI

STMicroelectronics

STPCI2GDYI by STMicroelectronics

STPCI2GDYI by STMicroelectronics is a multi-functional peripheral with 32-bit address bus width and 516 terminals. It operates b/w 0-85 °C, supports USB, PCI, ISA, PCMCIA buses, and has a clock frequency of 14.31818 MHz. Ideal for applications requiring high-speed data processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,697 parts In-Stock

1+ parts

-

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6,697

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Digiode

USA . 1,304 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,304

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Anansix

USA . 401 parts In-Stock

1+ parts

-

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401

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Nova Conductors

Japan . 32 parts In-Stock

1+ parts

-

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-

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 538 parts In-Stock

1+ parts

$13.711

100+ parts

-

1k+ parts

-

10k+ parts

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538

$13.711

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Ampacity Inc.

Singapore . 1,468 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,468

$20.000

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Corohmni

South Africa . 2,151 parts In-Stock

1+ parts

$49.069

100+ parts

-

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2,151

$49.069

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Aztec Data Supply Inc.

USA . 50 parts In-Stock

1+ parts

$53.150

100+ parts

-

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50

$53.150

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IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$64.562

100+ parts

-

1k+ parts

$58.106

10k+ parts

-

1,546

$64.562

-

$58.106

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Microchip USA

USA . 237 parts In-Stock

1+ parts

$86.818

100+ parts

-

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237

$86.818

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MKK Technologies

India . 2,346 parts In-Stock

1+ parts

$121.404

100+ parts

-

1k+ parts

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10k+ parts

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2,346

$121.404

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DigiPath Technology Company

USA . 2,346 parts In-Stock

1+ parts

$121.404

100+ parts

-

1k+ parts

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10k+ parts

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2,346

$121.404

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Lixinc

USA . 19,137 parts In-Stock

1+ parts

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19,137

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Continental Prestige Electronics

USA . 1,364 parts In-Stock

1+ parts

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1,364

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Parana Technologies

USA . 1,075 parts In-Stock

1+ parts

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100+ parts

$77.194

1k+ parts

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1,075

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$77.194

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Argo Parts USA

USA . 752 parts In-Stock

1+ parts

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752

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Corphita

USA . 682 parts In-Stock

1+ parts

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682

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Bastille Electronics

Australia . 26 parts In-Stock

1+ parts

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26

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Overview

Unlock the power of seamless connectivity with the STPCI2GDYI by STMicroelectronics. Crafted with precision and expertise, this multi-functional peripheral offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional value and benefits to customers looking to enhance their systems. Say goodbye to limitations and embrace endless possibilities with the STPCI2GDYI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and ensuring a long lifespan.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, saving space in your setup.

Maximum Supply Voltage: 2.7 V

Operates efficiently at a maximum supply voltage of 2.7 V, ensuring stable performance and power consumption.

Address Bus Width: 32

With a wide address bus width of 32, the product can handle large amounts of data processing efficiently.

Package Shape: SQUARE

Square package shape is compact and easy to integrate into various setups.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options (2.5V and 3.3V), providing flexibility in different operating environments.

No. of Terminals: 516

Large number of terminals (516) allow for extensive connectivity options and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers efficient heat dissipation and reliable electrical connections.

Minimum Supply Voltage: 2.45 V

Operates smoothly at a minimum supply voltage of 2.45 V, ensuring stability in various power conditions.

Maximum Operating Temperature: 85 °C

Capable of operating efficiently at high temperatures (up to 85°C), suitable for different working environments.

Minimum Operating Temperature: 0 °C

Works reliably even at low temperatures (down to 0°C), providing consistent performance in various conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish ensures good connectivity and resistance to corrosion, enhancing the product's durability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy installation and maintenance of the product in your setup.

Maximum Seated Height: 2.38 mm

With a low maximum seated height of 2.38 mm, the product is compact and can fit into tight spaces.

Width: 35 mm

Compact width of 35 mm ensures the product can be easily integrated into different setups without taking up much space.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging, ensuring reliable operation of the product.

External Data Bus Width: 32

Wide external data bus width of 32 enables fast and efficient data transfer between the product and external devices.

Maximum Clock Frequency: 14.31818 MHz

High maximum clock frequency of 14.31818 MHz enables fast processing speed, contributing to the product's overall performance.

Length: 35 mm

Compact length of 35 mm ensures the product can be easily accommodated in different setups.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

Ball terminal form provides secure connections and ease of installation, ensuring reliable performance of the product.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage of 2.5 V ensures consistent performance and power efficiency of the product.

Bus Compatibility: USB; PCI; ISA; PCMCIA

Compatible with various bus types (USB, PCI, ISA, PCMCIA), allowing for easy integration into different systems.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the product offers precise connections and compact design.

No. of I/O Lines: 24

With 24 I/O lines, the product allows for versatile input and output options, increasing its functionality.

Technical Specifications

Multi-functional Peripherals STPCI2GDYI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; ISA; PCMCIA

Maximum Clock Frequency:

14.31818 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e0

Length:

35 mm

No. of I/O Lines:

24

No. of Terminals:

516

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCI2GDYI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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