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STPCC0310BTC3

STMicroelectronics

STPCC0310BTC3 by STMicroelectronics

STPCC0310BTC3 by STMicroelectronics is a 32-bit multifunction peripheral IC with 388 terminals. It operates at a max clock frequency of 100 MHz and supports PCI and ISA bus compatibility. This CMOS technology device has a package style of grid array, making it suitable for various commercial applications requiring high-speed data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,859 parts In-Stock

1+ parts

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2,859

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Vyrian

USA . 2,501 parts In-Stock

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2,501

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Digiode

USA . 1,366 parts In-Stock

1+ parts

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1,366

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 149 parts In-Stock

1+ parts

$22.226

100+ parts

-

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149

$22.226

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IDEA Electronic Components Group

UK . 790 parts In-Stock

1+ parts

$77.626

100+ parts

-

1k+ parts

$69.863

10k+ parts

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790

$77.626

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$69.863

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MKK Technologies

India . 1,627 parts In-Stock

1+ parts

$145.970

100+ parts

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1,627

$145.970

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DigiPath Technology Company

USA . 1,627 parts In-Stock

1+ parts

$145.970

100+ parts

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1,627

$145.970

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Corphita

USA . 3,737 parts In-Stock

1+ parts

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3,737

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Parana Technologies

USA . 2,126 parts In-Stock

1+ parts

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100+ parts

$92.814

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2,126

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$92.814

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Overview

Elevate your technology with the STPCC0310BTC3 by STMicroelectronics, a cutting-edge multi-functional peripheral that delivers unparalleled performance and reliability. Manufactured by industry leader STMicroelectronics, this product is designed to meet the highest standards of quality and efficiency. From PCI to ISA bus compatibility, this versatile peripheral IC offers endless applications for a wide range of devices. Experience seamless integration and optimal functionality with the STPCC0310BTC3, providing you with the value and benefits you need to stay ahead in today's fast-paced tech world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for compatibility with a wide range of power sources, ensuring reliable operation.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into compact devices.

Power Supplies (V): 3.3

The 3.3V power supply ensures energy efficiency and compatibility with standard power sources.

Maximum Seated Height: 2.38 mm

The low maximum seated height allows for a slim design, making it suitable for thin form factor devices.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency enables fast data processing and performance, making it suitable for multitasking applications.

Technical Specifications

Multi-functional Peripherals STPCC0310BTC3 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

0 TO 100 OPERATING CASE TEMPERATURE

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Speed:

100 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCC0310BTC3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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