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PSD512B0-15J

STMicroelectronics

PSD512B0-15J by STMicroelectronics

PSD512B0-15J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features a compact square package with 68 terminals, ideal for embedded systems. This CMOS device supports various bus architectures, making it suitable for diverse applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,893 parts In-Stock

1+ parts

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4,893

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Vyrian

USA . 1,535 parts In-Stock

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1,535

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Anansix

USA . 1,180 parts In-Stock

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1,180

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,247 parts In-Stock

1+ parts

$34.713

100+ parts

-

1k+ parts

$31.242

10k+ parts

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1,247

$34.713

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$31.242

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Corohmni

South Africa . 56 parts In-Stock

1+ parts

$58.707

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56

$58.707

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MKK Technologies

India . 987 parts In-Stock

1+ parts

$65.276

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987

$65.276

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DigiPath Technology Company

USA . 987 parts In-Stock

1+ parts

$65.276

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987

$65.276

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Parana Technologies

USA . 1,267 parts In-Stock

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$41.505

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1,267

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$41.505

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Corphita

USA . 631 parts In-Stock

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631

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Overview

Unlock the power of innovation with the PSD512B0-15J from STMicroelectronics! This versatile multi-functional peripheral delivers exceptional performance and reliability, backed by a trusted name in technology. Ideal for diverse applications, it seamlessly integrates into your designs, ensuring efficient data processing and enhanced functionality. Experience superior quality, energy efficiency, and robust support that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package material ensures longevity and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides flexibility for various power supply options.

Address Bus Width: 16

A 16-bit address bus width supports a wide range of memory addressing, enhancing performance.

Package Shape: SQUARE

The square package shape offers balanced dimensions for easy mounting and component distribution.

No. of Terminals: 68

With 68 terminals, this product can handle multiple connections, making it versatile for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier design facilitates easy handling and assembly during manufacturing and integration.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows operation in low-voltage scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 70 °C

The capability to operate at temperatures up to 70 °C ensures that the device can perform reliably in warm environments.

Minimum Operating Temperature: 0 °C

The device can operate from 0 °C, making it suitable for a variety of indoor and outdoor applications.

Terminal Position: QUAD

The quad terminal position enhances layout flexibility, aiding in effective circuit design.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm provides a low profile, allowing for space-saving designs.

Width: 24.1808 mm

The precise width dimension offers a standardized fit for multiple applications and PCB designs.

External Data Bus Width: 8

An 8-bit external data bus width promotes high-speed data transfer for efficient processing.

Maximum Clock Frequency: 22 MHz

A maximum clock frequency of 22 MHz ensures fast processing speeds, suitable for demanding applications.

Length: 24.1808 mm

The specific length facilitates compatibility with existing circuit designs and layout standards.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for a wide range of typical usage environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: J BEND

J bend terminal form aids in secure connections and easy soldering process for manufacturing.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a common standard, ensuring compatibility with many devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Widespread bus compatibility allows integration into various system architectures, enhancing design flexibility.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports both dense and reliable connections, optimizing PCB layout.

No. of I/O Lines: 40

With 40 I/O lines, the device can interface with multiple peripherals, boosting overall system functionality.

Technical Specifications

Multi-functional Peripherals PSD512B0-15J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

22 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD512B0-15J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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