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CY8C4246AZI-L423

Infineon Technologies

CY8C4246AZI-L423 by Infineon Technologies

CY8C4246AZI-L423 by Infineon is a 48-terminal IC with 4096 RAM words, operating at up to 48 MHz. Ideal for industrial applications, it supports I2C, IRDA, LIN, SPI, UART, and USB bus compatibility. With a low profile package style and Gull Wing terminals, this CMOS technology device has a temperature range of -40 to 85 °C.

Median Price

$7.160

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 39 parts In-Stock

1+ parts

$6.180

100+ parts

$4.070

1k+ parts

$4.020

10k+ parts

-

39

$6.180

$4.070

$4.020

-

Chip1Stop

Japan . 497 parts In-Stock

1+ parts

$7.160

100+ parts

$4.630

1k+ parts

$4.340

10k+ parts

-

497

$7.160

$4.630

$4.340

-

DigiKey

USA . 853 parts In-Stock

1+ parts

$8.450

100+ parts

$5.558

1k+ parts

$5.037

10k+ parts

-

853

$8.450

$5.558

$5.037

-

Mouser Electronics

USA . 690 parts In-Stock

1+ parts

$8.450

100+ parts

$5.560

1k+ parts

$4.980

10k+ parts

-

690

$8.450

$5.560

$4.980

-

Element14

Singapore . 145 parts In-Stock

1+ parts

$11.570

100+ parts

$8.650

1k+ parts

$8.310

10k+ parts

-

145

$11.570

$8.650

$8.310

-

Rochester

USA . 374 parts In-Stock

1+ parts

-

100+ parts

$4.570

1k+ parts

$4.090

10k+ parts

$3.850

374

-

$4.570

$4.090

$3.850

Verical

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$5.713

1k+ parts

$5.112

10k+ parts

$4.813

195

-

$5.713

$5.112

$4.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 96 parts In-Stock

1+ parts

$3.942

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$3.942

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.335

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$6.335

-

-

-

Vyrian

USA . 473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

473

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 510 parts In-Stock

1+ parts

$3.735

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$3.735

-

-

-

Ampacity Inc.

Singapore . 430 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$4.170

-

-

-

Semicontronic

India . 257 parts In-Stock

1+ parts

$4.170

100+ parts

$4.066

1k+ parts

$4.045

10k+ parts

-

257

$4.170

$4.066

$4.045

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$6.208

100+ parts

-

1k+ parts

$5.960

10k+ parts

-

1,000

$6.208

-

$5.960

-

Continental Prestige Electronics

USA . 2,439 parts In-Stock

1+ parts

$6.335

100+ parts

-

1k+ parts

-

10k+ parts

$6.208

2,439

$6.335

-

-

$6.208

Corohmni

South Africa . 2,433 parts In-Stock

1+ parts

$21.036

100+ parts

-

1k+ parts

-

10k+ parts

-

2,433

$21.036

-

-

-

Microchip USA

USA . 2,819 parts In-Stock

1+ parts

$25.620

100+ parts

-

1k+ parts

-

10k+ parts

-

2,819

$25.620

-

-

-

Modulus Dynamics

Lithuania . 2,942 parts In-Stock

1+ parts

$74.945

100+ parts

$71.947

1k+ parts

$68.949

10k+ parts

-

2,942

$74.945

$71.947

$68.949

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,847

-

-

-

-

Argo Parts USA

USA . 3,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,676

-

-

-

-

Overview

Discover the game-changing CY8C4246AZI-L423 by Infineon Technologies, a must-have in the world of Multi-functional Peripherals. This cutting-edge device boasts top-tier quality from a trusted manufacturer, offering unrivaled performance and reliability. Perfect for a wide range of applications, this product delivers exceptional value, benefits, and advantages that cater to the diverse needs of customers. Upgrade your projects with the CY8C4246AZI-L423 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight design, making it a good choice for portable applications.

Surface Mount: YES

The surface mount feature allows for easy installation and compact design, ideal for space-constrained environments.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can accommodate a wide range of power sources, increasing its versatility.

Package Shape: SQUARE

The square package shape offers a uniform and efficient design, contributing to the product's overall stability and reliability.

No. of Terminals: 48

The ample number of terminals provides flexibility for various connectivity options and allows for versatile functionality.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures efficient use of space and enhances the product's overall performance.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage requirement enables energy efficiency and compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product's reliability even in extreme cold conditions.

Terminal Finish: PURE TIN

The use of pure tin as the terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position allows for efficient signal transmission and easy integration into existing systems.

Maximum Seated Height: 1.6 mm

The low maximum seated height contributes to the product's compact design, making it suitable for space-constrained applications.

RAM Words: 4096

With a large RAM capacity, this product can handle complex tasks efficiently and effectively.

Technical Specifications

Multi-functional Peripherals CY8C4246AZI-L423 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

NO

Bus Compatibility:

I2C; IRDA; LIN; SPI; UART; USB

Maximum Clock Frequency:

48 MHz

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Words:

4096

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

14.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CY8C4246AZI-L423 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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