Loading...

CY8C3246AXI-138T

Infineon Technologies

CY8C3246AXI-138T by Infineon Technologies

CY8C3246AXI-138T by Infineon: Operates at 1.71-5.5V, with 4096 RAM words and 33MHz clock frequency. Ideal for industrial applications requiring 8051, I2C, SPI interfaces in a compact 14mm square package.

Median Price

$16.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 994 parts In-Stock

1+ parts

$16.940

100+ parts

$10.870

1k+ parts

$8.870

10k+ parts

$8.870

994

$16.940

$10.870

$8.870

$8.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 189 parts In-Stock

1+ parts

$13.300

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$13.300

-

-

-

Vyrian

USA . 120 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

120

$14.000

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 821 parts In-Stock

1+ parts

$11.900

100+ parts

-

1k+ parts

-

10k+ parts

-

821

$11.900

-

-

-

Corphita

USA . 274 parts In-Stock

1+ parts

$12.600

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$12.600

-

-

-

Microchip USA

USA . 2,313 parts In-Stock

1+ parts

$25.872

100+ parts

-

1k+ parts

-

10k+ parts

-

2,313

$25.872

-

-

-

Corohmni

South Africa . 886 parts In-Stock

1+ parts

$31.227

100+ parts

-

1k+ parts

-

10k+ parts

-

886

$31.227

-

-

-

Modulus Dynamics

Lithuania . 2,818 parts In-Stock

1+ parts

$54.535

100+ parts

$52.354

1k+ parts

$50.172

10k+ parts

-

2,818

$54.535

$52.354

$50.172

-

Argo Parts USA

USA . 2,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,086

-

-

-

-

Formix International (Excess)

India . 1,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,795

-

-

-

-

Continental Prestige Electronics

USA . 1,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,016

-

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unlock endless possibilities with the CY8C3246AXI-138T by Infineon Technologies. This multi-functional peripheral device offers unparalleled quality and reliability, making it a top choice for a wide range of applications. From industrial automation to consumer electronics, this product provides value, efficiency, and innovation. Experience seamless integration, high performance, and unmatched versatility with the CY8C3246AXI-138T. Elevate your projects to new heights with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the multi-functional peripheral easy to handle and long-lasting.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of power input, ensuring compatibility with various power sources.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures, making it suitable for use in different environments.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, enhancing the efficiency and reliability of the multi-functional peripheral.

Maximum Clock Frequency: 33 MHz

High clock frequency allows for fast data processing and operation, resulting in quick and efficient performance.

Technical Specifications

Multi-functional Peripherals CY8C3246AXI-138T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

8051; I2C; I2S; IDE; LIN; PS/2; SIO; SMBUS; SPI; UART; USB

Maximum Clock Frequency:

33 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

RAM Words:

4096

ROM Bits Size:

524288 Bits

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

CY8C3246AXI-138T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20