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CC3130RNMRGKR

Texas Instruments

CC3130RNMRGKR by Texas Instruments

CC3130RNMRGKR by Texas Instruments is a 64-terminal chip carrier with SPI and UART bus compatibility, operating at up to 40 MHz. It has a supply voltage range of 2.1V to 3.6V, making it suitable for industrial applications requiring multi-functional peripherals in a compact square package style. With a temperature range of -40°C to 85°C, this CMOS technology-based IC offers high performance in various environments.

Median Price

$5.789

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,668 parts In-Stock

1+ parts

$5.789

100+ parts

$4.719

1k+ parts

$3.146

10k+ parts

-

10,668

$5.789

$4.719

$3.146

-

Mouser Electronics

USA . 5,000 parts In-Stock

1+ parts

$10.170

100+ parts

$6.510

1k+ parts

$4.990

10k+ parts

$4.850

5,000

$10.170

$6.510

$4.990

$4.850

DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.267

2,500

-

-

-

$5.267

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,644 parts In-Stock

1+ parts

$3.930

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

$3.930

-

-

-

Digiode

USA . 2,780 parts In-Stock

1+ parts

$5.092

100+ parts

-

1k+ parts

-

10k+ parts

-

2,780

$5.092

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 367 parts In-Stock

1+ parts

$4.824

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$4.824

-

-

-

Component Stockers USA

USA . 11,426 parts In-Stock

1+ parts

$6.640

100+ parts

$4.980

1k+ parts

$3.030

10k+ parts

-

11,426

$6.640

$4.980

$3.030

-

Native Components

USA . 988 parts In-Stock

1+ parts

$8.700

100+ parts

-

1k+ parts

-

10k+ parts

-

988

$8.700

-

-

-

Northwest PG Solutions

USA . 1,800 parts In-Stock

1+ parts

$9.570

100+ parts

$8.613

1k+ parts

-

10k+ parts

-

1,800

$9.570

$8.613

-

-

Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

$13.860

100+ parts

-

1k+ parts

$14.340

10k+ parts

-

1,731

$13.860

-

$14.340

-

DigiPath Technology Company

USA . 844 parts In-Stock

1+ parts

$15.262

100+ parts

-

1k+ parts

-

10k+ parts

-

844

$15.262

-

-

-

ChromeModa Solutions

Germany . 6,647 parts In-Stock

1+ parts

$15.573

100+ parts

$12.770

1k+ parts

-

10k+ parts

-

6,647

$15.573

$12.770

-

-

IDEA Electronic Components Group

UK . 282 parts In-Stock

1+ parts

$15.573

100+ parts

$14.794

1k+ parts

$14.016

10k+ parts

-

282

$15.573

$14.794

$14.016

-

Corohmni

South Africa . 5,156 parts In-Stock

1+ parts

$56.499

100+ parts

-

1k+ parts

-

10k+ parts

-

5,156

$56.499

-

-

-

Overview

Experience the ultimate in connectivity with the Texas Instruments CC3130RNMRGKR. As a leader in the industry, Texas Instruments delivers top-quality multi-functional peripherals that are versatile and reliable. This product is perfect for a wide range of applications, providing seamless integration and high performance. With advanced technology and superior design, the CC3130RNMRGKR offers customers unmatched value and benefits. Upgrade your devices today and discover the advantages of Texas Instruments products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and lightweight design, making the product suitable for portable applications.

Maximum Supply Voltage: 3.6 V

Supports high power performance for efficient operation.

Minimum Supply Voltage: 2.1 V

Allows for flexibility in power input options while ensuring stable operation.

Maximum Operating Temperature: 85 °C

Ensures reliability and functionality in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and conductivity for reliable connections.

Maximum Clock Frequency: 40 MHz

Enables fast data processing and efficient performance.

Technology: CMOS

Offers low power consumption and high noise immunity for improved efficiency.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with various systems.

Bus Compatibility: SPI, UART

Supports multiple communication protocols for versatile connectivity options.

Moisture Sensitivity Level (MSL): 3

Indicates the level of sensitivity to moisture, ensuring proper handling and storage.

Technical Specifications

Multi-functional Peripherals CC3130RNMRGKR attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI, UART

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC3130RNMRGKR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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