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CY8C28643-24LTXI

Infineon Technologies

CY8C28643-24LTXI by Infineon Technologies

CY8C28643-24LTXI by Infineon: 8-bit, 24 MHz CPU with 16384 ROM words and 1024 RAM bytes. Ideal for industrial applications, featuring I2C, IRDA, SPI, UART, USB compatibility and a max supply voltage of 5.25 V. Terminal pitch of 0.5 mm in a square package style with 48 terminals.

Median Price

$7.188

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,238 parts In-Stock

1+ parts

-

100+ parts

$6.390

1k+ parts

$5.720

10k+ parts

$5.380

1,238

-

$6.390

$5.720

$5.380

Verical

USA . 1,238 parts In-Stock

1+ parts

-

100+ parts

$7.987

1k+ parts

$7.150

10k+ parts

$6.725

1,238

-

$7.987

$7.150

$6.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 913 parts In-Stock

1+ parts

$6.745

100+ parts

-

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-

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913

$6.745

-

-

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Vyrian

USA . 626 parts In-Stock

1+ parts

$7.100

100+ parts

-

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626

$7.100

-

-

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Bristol Electronics

USA . 260 parts In-Stock

1+ parts

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260

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 985 parts In-Stock

1+ parts

$6.030

100+ parts

-

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985

$6.030

-

-

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Corphita

USA . 219 parts In-Stock

1+ parts

$6.390

100+ parts

-

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219

$6.390

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Microchip USA

USA . 2,148 parts In-Stock

1+ parts

$20.031

100+ parts

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10k+ parts

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2,148

$20.031

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Modulus Dynamics

Lithuania . 689 parts In-Stock

1+ parts

$48.378

100+ parts

$46.443

1k+ parts

$44.508

10k+ parts

-

689

$48.378

$46.443

$44.508

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Corohmni

South Africa . 1,071 parts In-Stock

1+ parts

$74.838

100+ parts

-

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1,071

$74.838

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 2,712 parts In-Stock

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Argo Parts USA

USA . 932 parts In-Stock

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932

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Perfect Parts

USA . 368 parts In-Stock

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368

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock endless possibilities with the CY8C28643-24LTXI by Infineon Technologies, a cutting-edge multi-functional peripheral that combines innovation and reliability. Infineon's stellar reputation for quality ensures that this product offers unmatched performance and durability. Ideal for a wide range of applications, this versatile chip carrier boasts a compact square package and a powerful 8-bit CPU family, making it perfect for industrial use. Experience seamless integration with I2C, IRDA, SPI, UART, and USB bus compatibility, all while enjoying the peace of mind that comes with choosing a trusted industry leader. Elevate your projects with the CY8C28643-24LTXI and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration of this product into a circuit board, saving space and allowing for a more compact design.

Maximum Supply Voltage: 5.25 V

Supports a wide range of supply voltages, providing flexibility in powering the device and making it suitable for various applications.

No. of Terminals: 48

With a high number of terminals, this product can support multiple connections and interfaces, enhancing its versatility and compatibility.

CPU Family: M8C

The M8C CPU family offers efficient processing power for a multi-functional peripheral, enabling quick and reliable operation for various functions.

Maximum Clock Frequency: 24 MHz

With a high clock frequency, this product can handle complex tasks and data processing quickly, improving overall performance and responsiveness.

Technical Specifications

Multi-functional Peripherals CY8C28643-24LTXI attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

Bus Compatibility:

I2C, IRDA, SPI, UART, USB

CPU Family:

M8C

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

14 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CY8C28643-24LTXI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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