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ZPSD513B1-70JI

STMicroelectronics

ZPSD513B1-70JI by STMicroelectronics

ZPSD513B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications. Its compact design ensures reliability across -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,533 parts In-Stock

1+ parts

-

100+ parts

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3,533

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Vyrian

USA . 1,420 parts In-Stock

1+ parts

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1k+ parts

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1,420

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Anansix

USA . 777 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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777

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,209 parts In-Stock

1+ parts

$59.888

100+ parts

-

1k+ parts

-

10k+ parts

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1,209

$59.888

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-

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IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$76.468

100+ parts

-

1k+ parts

$68.821

10k+ parts

-

786

$76.468

-

$68.821

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MKK Technologies

India . 1,169 parts In-Stock

1+ parts

$143.792

100+ parts

-

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1,169

$143.792

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DigiPath Technology Company

USA . 1,169 parts In-Stock

1+ parts

$143.792

100+ parts

-

1k+ parts

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10k+ parts

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1,169

$143.792

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Corphita

USA . 1,415 parts In-Stock

1+ parts

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1,415

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Parana Technologies

USA . 962 parts In-Stock

1+ parts

-

100+ parts

$91.429

1k+ parts

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10k+ parts

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962

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$91.429

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Overview

Unlock the potential of your designs with the ZPSD513B1-70JI from STMicroelectronics, a leader in innovation and quality. This multi-functional peripheral combines reliability with versatility, perfect for industrial applications where precision matters. Its robust performance at extreme temperatures ensures seamless operations, while its compact design saves space. Trust STMicroelectronics to deliver superior value and benefits that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and protection against environmental factors, making it ideal for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating high-density circuit layouts which are essential for modern multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can operate safely within the limits of typical logic circuits, enhancing reliability.

Address Bus Width: 16

A 16-bit address bus width provides extensive memory addressing capability, suitable for handling large amounts of data efficiently.

Package Shape: SQUARE

The square package shape optimizes board space and aligns easily with standard PCB layouts, facilitating easy integration.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V ensures compatibility with a wide range of electronic devices, simplifying power management.

No. of Terminals: 68

With 68 terminals, this multi-functional peripheral supports extensive connectivity options, allowing for greater flexibility in design.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for easy handling and integration into circuit boards, enhancing manufacturability.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5 V allows for lower power applications, reducing overall energy consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for a wide range of industrial environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Capable of functioning at -40 °C, this peripheral is ideal for harsh conditions, enhancing versatility for outdoor or extreme applications.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and reliability in connections, making sure that the device functions optimally.

Terminal Position: QUAD

Quad terminal positioning allows for better space utilization on the PCB and efficient routing of signal lines, improving overall performance.

Maximum Seated Height: 4.57 mm

The compact seated height promotes low-profile designs, reducing space occupied on the PCB while maintaining performance.

RAM Words: 1024

With 1024 words of RAM, this device can handle significant amounts of temporary data storage, enhancing performance for concurrent operations.

Width: 24.1808 mm

The width of 24.1808 mm provides sufficient space for component integration while maintaining a compact form factor.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data transfers, making this peripheral well-suited for various applications.

Maximum Clock Frequency: 36 MHz

A clock frequency of 36 MHz enables rapid processing and responsiveness, essential for modern computing tasks.

Length: 24.1808 mm

The length of 24.1808 mm offers a balance between size and connectivity, fitting well within standard electronic designs.

Temperature Grade: INDUSTRIAL

Grade-rated for industrial use, ensuring reliability and performance in demanding environments, making this a durable choice.

ROM Bits Size: 1024 Bits

With 1024 bits of ROM, this product is well-equipped for storing essential firmware, enabling effective device operation.

Technology: CMOS

CMOS technology ensures low power consumption and high reliability, making it suitable for battery-operated and portable devices.

Terminal Form: J BEND

J bend terminal forms facilitate easier soldering and secure connections, which enhance overall device durability.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5 V strengthens compatibility with existing systems, reducing the need for additional power regulation.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Broad bus compatibility makes this peripheral versatile for various systems, allowing for easier integration and upgrades.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a denser arrangement of connections, optimizing space and maintaining reliable signal integrity.

Maximum Standby Current: 0.00002 Amp

Low standby current minimizes power consumption during idle times, enhancing energy efficiency in battery-powered applications.

Maximum Access Time: 0.00000007 ns

Extremely fast access time of 70 ns ensures quick response times, improving overall device performance and user experience.

No. of I/O Lines: 40

40 I/O lines provide extensive interfacing options, enabling the peripheral to interact with a variety of external devices and sensors.

Technical Specifications

Multi-functional Peripherals ZPSD513B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.1808 mm

Trade Compliance

ZPSD513B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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