Loading...

STPCD0175BTI3

STMicroelectronics

STPCD0175BTI3 by STMicroelectronics

STPCD0175BTI3 by STMicroelectronics is a versatile multi-functional peripheral with a 32-bit address bus and operates at 3.0-3.6V. It features a max clock frequency of 14.318 MHz and supports PCI/ISA bus compatibility, ideal for industrial applications. Its compact design includes a square grid array with 388 terminals, ensuring efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,776

-

-

-

-

Digiode

USA . 3,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,957

-

-

-

-

Anansix

USA . 99 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

99

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$22.769

100+ parts

$20.720

1k+ parts

$18.671

10k+ parts

-

2,500

$22.769

$20.720

$18.671

-

Corohmni

South Africa . 1,026 parts In-Stock

1+ parts

$40.611

100+ parts

-

1k+ parts

-

10k+ parts

-

1,026

$40.611

-

-

-

IDEA Electronic Components Group

UK . 439 parts In-Stock

1+ parts

$52.374

100+ parts

-

1k+ parts

$47.136

10k+ parts

-

439

$52.374

-

$47.136

-

MKK Technologies

India . 2,363 parts In-Stock

1+ parts

$98.485

100+ parts

-

1k+ parts

-

10k+ parts

-

2,363

$98.485

-

-

-

DigiPath Technology Company

USA . 2,363 parts In-Stock

1+ parts

$98.485

100+ parts

-

1k+ parts

-

10k+ parts

-

2,363

$98.485

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Corphita

USA . 2,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,895

-

-

-

-

Kepictronics

USA . 920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

920

-

-

-

-

Parana Technologies

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$62.621

1k+ parts

-

10k+ parts

-

481

-

$62.621

-

-

Overview

Unlock unparalleled performance with the STPCD0175BTI3 from STMicroelectronics, a trusted leader in multi-functional peripherals. This innovative device excels in diverse applications, ensuring robust operation even in extreme conditions. With its superior quality and reliability, customers benefit from enhanced efficiency and long-term durability, making it ideal for industrial use. Choose STMicroelectronics for cutting-edge technology that drives your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, facilitating space-saving solutions.

Maximum Supply Voltage: 3.6 V

A relatively low maximum supply voltage contributes to lower power consumption, enhancing energy efficiency in multi-functional peripherals.

Address Bus Width: 32

A 32-bit address bus width supports high data throughput, making the product ideal for demanding applications requiring fast data access.

Package Shape: SQUARE

The square package shape optimizes layout and assembly in various applications, promoting efficient use of PCB space.

No. of Terminals: 388

With 388 terminals, the product supports multiple functionalities and features, enhancing its versatility across different applications.

Package Style (Meter): GRID ARRAY

The grid array style facilitates effective heat dissipation and improved electrical performance, contributing to overall system reliability.

Minimum Supply Voltage: 3 V

This low minimum supply voltage broadens compatibility with various power management systems, making the product suitable for energy-sensitive applications.

Maximum Operating Temperature: 100 °C

A high maximum operating temperature indicates robustness and reliability, ensuring consistent performance in extreme conditions.

Minimum Operating Temperature: -40 °C

The capability to operate at very low temperatures expands the range of environments in which the product can function efficiently.

Terminal Position: BOTTOM

Bottom terminal positions allow for efficient connection to the PCB, promoting better signal integrity and ease of assembly.

Maximum Seated Height: 2.38 mm

A low seated height allows for a more compact design, which is beneficial in applications where space is a constraint.

Width: 35 mm

A moderate width of 35 mm strikes a balance between robustness and compactness, making it suitable for various designs.

External Data Bus Width: 32

The 32-bit external data bus width enables high-speed data communication, essential for advanced multi-functional peripheral tasks.

Maximum Clock Frequency: 14.318 MHz

A clock frequency of 14.318 MHz supports efficient data processing, ensuring quick responsiveness in multi-functional operations.

Length: 35 mm

Like the width, a length of 35 mm contributes to a compact form factor, which is advantageous for space-limited designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade denotes reliability in harsh environments, making it ideal for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed, enhancing performance in multi-functional peripheral applications.

Terminal Form: BALL

Ball terminal form simplifies surface mounting, ensuring a secure connection and improving assembly efficiency.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is standard for many digital systems, ensuring compatibility with a wide range of components.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA buses offers flexibility in integration with various legacy and contemporary systems, enhancing usability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for greater density on PCBs, enabling more complex functionalities within a compact footprint.

Technical Specifications

Multi-functional Peripherals STPCD0175BTI3 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

-40 TO 100 OPERATING CASE TEMPERATURE

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCD0175BTI3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20