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PSD512B1-70LI

STMicroelectronics

PSD512B1-70LI by STMicroelectronics

PSD512B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its compact design includes a ceramic, metal-sealed package suitable for surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,379 parts In-Stock

1+ parts

-

100+ parts

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4,379

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Digiode

USA . 2,624 parts In-Stock

1+ parts

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1k+ parts

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2,624

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Anansix

USA . 1,039 parts In-Stock

1+ parts

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1,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,605 parts In-Stock

1+ parts

$18.232

100+ parts

-

1k+ parts

$16.408

10k+ parts

-

1,605

$18.232

-

$16.408

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MKK Technologies

India . 2,306 parts In-Stock

1+ parts

$34.283

100+ parts

-

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10k+ parts

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2,306

$34.283

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DigiPath Technology Company

USA . 2,306 parts In-Stock

1+ parts

$34.283

100+ parts

-

1k+ parts

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10k+ parts

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2,306

$34.283

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Corohmni

South Africa . 718 parts In-Stock

1+ parts

$61.234

100+ parts

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718

$61.234

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Corphita

USA . 4,461 parts In-Stock

1+ parts

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4,461

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Parana Technologies

USA . 835 parts In-Stock

1+ parts

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100+ parts

$21.799

1k+ parts

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835

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$21.799

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Overview

Unlock unparalleled performance with the PSD512B1-70LI from STMicroelectronics, a leader in innovative technology. This multi-functional peripheral offers exceptional reliability and versatility for industrial applications, ensuring optimal operation even in extreme environments. Its compact design and robust features empower customers to enhance their projects, streamline processes, and achieve superior results. Experience quality you can trust, and elevate your solutions with ST's commitment to excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired materials ensure high reliability and robustness in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for efficient use of space and simplifies the manufacturing process, enabling higher production rates.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options while ensuring compatibility with other components.

Address Bus Width: 16

A 16-bit address bus width allows for a larger memory addressing capability, making it suitable for complex applications.

Package Shape: SQUARE

The square package shape facilitates efficient PCB layout and placement, optimizing design for compact applications.

No. of Terminals: 68

With 68 terminals, this device supports a wide range of connectivity options, enabling versatile integrations.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window style enhances thermal performance and visual inspection capability for quality assurance.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V enhances compatibility with a variety of power supplies, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

The capability to operate at temperatures up to 85 °C ensures reliability in high-temperature environments typical of industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for use in extreme cold conditions, expanding its application range.

Terminal Position: QUAD

The quad terminal position simplifies routing on PCBs, enhancing design efficiency and reducing potential signal integrity issues.

Maximum Seated Height: 4.57 mm

A low profile design at 4.57 mm makes it suitable for compact installations where space is a premium.

RAM Words: 1024

Having 1024 RAM words provides substantial memory capacity for data processing, enabling more complex and feature-rich applications.

Width: 24.105 mm

The width of 24.105 mm allows for an efficient design footprint, making it easier to integrate into existing systems.

External Data Bus Width: 8

An 8-bit external data bus width ensures compatibility with a wide range of microcontrollers and peripherals, promoting interoperability.

Maximum Clock Frequency: 36 MHz

Running at a maximum clock frequency of 36 MHz allows for high-speed operation, resulting in better performance for demanding applications.

Length: 24.105 mm

Similar to its width, the length of 24.105 mm allows for a compact design that fits well in space-constrained environments.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies suitability for rugged environments, ensuring long-term reliability and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, which enhances efficiency and reliability in various operating conditions.

Terminal Form: J BEND

The J bend terminal form allows for secure mounting on PCBs, making it robust against mechanical stress and thermal cycling.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with standard logic levels, ensuring seamless integration with a variety of digital circuits.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility allows for easier interfacing with various microcontrollers and systems, enhancing flexibility in design choices.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch ensures compatibility with standard PCB layouts, making assembly and soldering processes simpler.

No. of I/O Lines: 40

With 40 I/O lines, this product can manage multiple connections efficiently, ideal for multi-functional peripheral applications.

Technical Specifications

Multi-functional Peripherals PSD512B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD512B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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