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PSD511B1-90LI

STMicroelectronics

PSD511B1-90LI by STMicroelectronics

PSD511B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words and supports various bus types, making it ideal for industrial applications. Its compact ceramic package ensures reliability in extreme temperatures from -40 °C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,562 parts In-Stock

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2,562

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Digiode

USA . 1,228 parts In-Stock

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1,228

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Anansix

USA . 160 parts In-Stock

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160

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$43.405

100+ parts

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1k+ parts

$39.064

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997

$43.405

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$39.064

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MKK Technologies

India . 649 parts In-Stock

1+ parts

$81.620

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649

$81.620

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DigiPath Technology Company

USA . 649 parts In-Stock

1+ parts

$81.620

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649

$81.620

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Parana Technologies

USA . 2,304 parts In-Stock

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$51.897

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2,304

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$51.897

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Corphita

USA . 1,712 parts In-Stock

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1,712

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Overview

Elevate your designs with the PSD511B1-90LI from STMicroelectronics—a trusted leader in innovation. This versatile multi-functional peripheral is crafted with quality ceramic and metal-sealed materials, ensuring durability in demanding environments. With its robust operating range and compatibility across various architectures, it's ideal for industrial applications. Experience enhanced performance, reliability, and efficiency, making your projects not just successful, but exceptional!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction enhances reliability and protects against environmental elements, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and efficient use of PCB space, which is ideal for modern multifunctional peripherals.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the component ensures compliance with a wide range of compatible devices, enhancing versatility.

Address Bus Width: 16

The 16-bit address bus provides ample addressing capability, enabling efficient access to larger memory spaces for complex applications.

Package Shape: SQUARE

The square package shape allows for efficient layout options on PCBs, facilitating better thermal management and reducing signal integrity issues.

No. of Terminals: 68

With 68 terminals, this component supports a greater number of connections, enhancing functionality and enabling diverse peripheral integration.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window style allows for better heat dissipation, which is critical for maintaining performance in various working conditions.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V broadens operational range, ensuring compatibility with varying power sources.

Maximum Operating Temperature: 85 °C

The capability to operate at temperatures up to 85 °C indicates high reliability in demanding environments typically encountered in industrial settings.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows the product to function in extreme cold conditions, making it suitable for outdoor and harsh environments.

Terminal Position: QUAD

Quad terminal positioning ensures improved connectivity options, leading to enhanced performance in multi-functional peripheral applications.

Maximum Seated Height: 4.57 mm

A compact seated height of 4.57 mm is advantageous for space-constrained designs without compromising on performance.

RAM Words: 1024

With 1024 RAM words, the product offers adequate memory for efficient data handling and processing capabilities.

Width: 24.105 mm

The 24.105 mm width facilitates the integration of multiple components on a single board, making it suitable for compact designs.

External Data Bus Width: 8

An 8-bit external data bus width allows for effective data transfer rates, enhancing the overall system performance.

Maximum Clock Frequency: 30 MHz

Supporting a maximum clock frequency of 30 MHz enables faster processing, improving the responsiveness of multi-functional peripherals.

Length: 24.105 mm

The overall length of 24.105 mm contributes to a balanced package size for optimal layout efficiency on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh environments, making it suitable for varied applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making this product efficient for use in various devices.

Terminal Form: J BEND

The J bend terminal form simplifies the assembly process, ensuring easy mounting and connectivity in design.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with standard electronic designs, enhancing compatibility with a range of peripherals.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility allows seamless integration into existing systems, making it a flexible choice for developers.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates dense PCB layouts, maximizing space while maintaining reliable connections.

No. of I/O Lines: 40

Having 40 I/O lines enables extensive peripheral connectivity, allowing users to expand functionality and cater to various use cases.

Technical Specifications

Multi-functional Peripherals PSD511B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD511B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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