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ZPSD512B0-15J

STMicroelectronics

ZPSD512B0-15J by STMicroelectronics

ZPSD512B0-15J by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and 40 I/O lines. It operates at a nominal voltage of 5V, supporting up to 22 MHz clock frequency. Ideal for applications requiring compact, reliable data processing in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,309

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-

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Digiode

USA . 2,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,124

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Anansix

USA . 1,404 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,404

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,854 parts In-Stock

1+ parts

$34.018

100+ parts

-

1k+ parts

$30.616

10k+ parts

-

1,854

$34.018

-

$30.616

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MKK Technologies

India . 201 parts In-Stock

1+ parts

$63.968

100+ parts

-

1k+ parts

-

10k+ parts

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201

$63.968

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DigiPath Technology Company

USA . 201 parts In-Stock

1+ parts

$63.968

100+ parts

-

1k+ parts

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10k+ parts

-

201

$63.968

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Parana Technologies

USA . 2,052 parts In-Stock

1+ parts

-

100+ parts

$40.674

1k+ parts

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10k+ parts

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2,052

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$40.674

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Corphita

USA . 81 parts In-Stock

1+ parts

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81

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Overview

Unlock endless possibilities with the ZPSD512B0-15J from STMicroelectronics, a trusted leader in innovative solutions. This versatile multi-functional peripheral enhances your designs with exceptional reliability and efficiency. Ideal for applications ranging from embedded systems to consumer electronics, it seamlessly integrates into various projects. Enjoy the benefits of superior quality, robust performance, and the peace of mind that comes from partnering with a top-tier manufacturer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures that the product is robust, lightweight, and suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier integration onto circuit boards, making it ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of digital and microcontroller systems while maintaining safety margins.

Address Bus Width: 16

A 16-bit address bus width enables the product to access a larger memory space, enhancing its performance and versatility in various applications.

Package Shape: SQUARE

The square package shape contributes to efficient space utilization on circuit boards, allowing for better layout and organization.

No. of Terminals: 68

With 68 terminals, this product offers ample connectivity options, making it suitable for complex circuitry and multi-functional setups.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides effective heat dissipation and protects the integrated circuits, ensuring reliable operation over time.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for flexible power supply options, providing adaptability in various device configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for a wide range of environments, ensuring reliability in high-temperature situations.

Minimum Operating Temperature: 0 °C

The ability to operate down to 0 °C makes this product ideal for applications in cooler climates, ensuring consistent performance across temperature ranges.

Terminal Position: QUAD

Quad terminal positioning allows for easier routing and layout on printed circuit boards, optimizing space and improving signal integrity.

Maximum Seated Height: 4.57 mm

A low seated height of 4.57 mm enables sleek designs in compact electronic devices, facilitating integration in space-constrained applications.

Width: 24.1808 mm

The specified width ensures compatibility with standard mounting designs, making it easier to incorporate into existing systems.

External Data Bus Width: 8

An 8-bit external data bus width supports standard data processing operations, making this product compatible with a variety of systems.

Maximum Clock Frequency: 22 MHz

A maximum clock frequency of 22 MHz allows for efficient data processing speeds, enhancing overall performance and responsiveness.

Length: 24.1808 mm

The length matches standard size requirements, facilitating easy integration and compatibility with many device enclosures.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade ensures reliable operation for everyday electronics, meeting the needs of a broad range of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable under various conditions.

Terminal Form: J BEND

J bend terminals are designed for secure connections, ensuring stable electrical performance and simplifying the assembly process.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard for many digital applications, ensuring compatibility with most existing electronic systems.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility allows this product to interface with various microcontrollers and processors, enhancing its utility in diverse projects.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm optimizes the connection density on circuit boards, allowing for efficient use of space in electronic designs.

No. of I/O Lines: 40

Offering 40 I/O lines provides extensive connectivity options for peripheral devices, enabling multi-functional capability and flexibility in design.

Technical Specifications

Multi-functional Peripherals ZPSD512B0-15J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

22 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

ZPSD512B0-15J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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