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EFR32BG21B020F1024IM32-B

Silicon Labs

EFR32BG21B020F1024IM32-B by Silicon Labs

EFR32BG21B020F1024IM32-B by Silicon Labs is a versatile chip carrier with 32 terminals, operating at -40 to 125 °C. It features a max clock frequency of 38.4 MHz and supports I2C, I2S, IRDA, SPI, UART, and USART buses. Ideal for automotive applications due to its low profile design and CMOS technology.

Median Price

$5.850

Lifecycle Status

Suppliers In-Stock

9

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1k+

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Symmetry

USA . 1 parts In-Stock

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$4.360

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Mouser Electronics

USA . 446 parts In-Stock

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$5.850

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$4.390

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$4.240

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DigiKey

USA . 1,835 parts In-Stock

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$6.640

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$5.024

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$4.427

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$4.332

1,835

$6.640

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$4.332

Distributors (In-Stock)

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Digiode

USA . 970 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 480 parts In-Stock

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$5.905

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$2.775

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$2.539

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Nova Conductors

Japan . 750 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Ampacity Inc.

Singapore . 943 parts In-Stock

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$3.710

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Corphita

USA . 78 parts In-Stock

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$3.924

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Corohmni

South Africa . 4,885 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Aranea Global

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Argo Parts USA

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Overview

Experience the next level of performance with Silicon Labs' EFR32BG21B020F1024IM32-B, a cutting-edge multi-functional peripheral that offers unparalleled quality and reliability. This versatile component is perfect for a wide range of applications, providing customers with seamless integration and enhanced functionality. With a maximum clock frequency of 38.4 MHz and a temperature grade designed for automotive use, this product delivers exceptional value and benefits to ensure your projects run smoothly and efficiently. Trust Silicon Labs to provide top-of-the-line solutions for all your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in assembly.

Maximum Supply Voltage: 3.8 V

Provides a wide operating range for flexibility in power supply options.

Package Shape: SQUARE

Square shape facilitates more efficient use of space on the PCB.

No. of Terminals: 32

Offers a sufficient number of terminals for versatile connectivity options.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides options for different mounting styles based on the application requirements.

Minimum Supply Voltage: 1.71 V

Ensures compatibility with lower voltage power sources for energy-efficient operation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for a variety of operational environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold conditions without performance degradation.

Terminal Position: QUAD

Quad terminal position allows for efficient signal routing and reduces signal interference.

Maximum Seated Height: 0.9 mm

Low profile design enables the component to be used in compact devices or systems.

RAM Words: 98304

Ample memory capacity for storage and processing of data.

Width: 4 mm

Compact width saves space on the PCB and allows for more components to be placed in close proximity.

Maximum Clock Frequency: 38.4 MHz

High clock frequency enables fast data processing and communication.

Length: 4 mm

Compact length enables the component to fit in small spaces without compromising functionality.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for durability and reliability in automotive applications.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Versatile functionality to support multiple peripheral devices for enhanced system capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmental friendliness and compliance with regulations.

Nominal Supply Voltage: 3 V

Standard supply voltage for compatibility with common power sources.

No. of Serial I/Os: 3

Multiple serial I/Os for efficient communication with external devices.

Bus Compatibility: I2C, I2S, IRDA, SPI, UART, USART

Supports various communication protocols for seamless integration with different devices and systems.

Terminal Pitch: 0.4 mm

Fine pitch terminals for high density mounting and compact design.

No. of I/O Lines: 20

Sufficient I/O lines for versatile connectivity and interfacing with external components.

Technical Specifications

Multi-functional Peripherals EFR32BG21B020F1024IM32-B attributes and parameters. Explore more Multi-functional Peripherals devices from Silicon Labs

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

I2C, I2S, IRDA, SPI, UART, USART

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

4 mm

No. of I/O Lines:

20

No. of Serial I/Os:

3

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

98304

Maximum Seated Height:

.9 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Peripheral IC Type:

Trade Compliance

EFR32BG21B020F1024IM32-B Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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