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DRA756PPIGABZQ1

Texas Instruments

DRA756PPIGABZQ1 by Texas Instruments

DRA756PPIGABZQ1 by Texas Instruments is a multi-functional peripheral with 32MHz clock frequency, 2.5M RAM words, and 32-bit external data bus width. Ideal for automotive applications due to AEC-Q100 screening level and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,884 parts In-Stock

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4,884

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Vyrian

USA . 2,987 parts In-Stock

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2,987

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Distributors (Availability)

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Northwest PG Solutions

USA . 546 parts In-Stock

1+ parts

$3.390

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546

$3.390

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One Stop Electronics

USA . 167 parts In-Stock

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$4.000

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167

$4.000

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AZTECH Wire

Italy . 273 parts In-Stock

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$15.921

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$15.921

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Corohmni

South Africa . 2,730 parts In-Stock

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$52.191

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$52.191

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Parana Technologies

USA . 775 parts In-Stock

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$53.097

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775

$53.097

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DigiPath Technology Company

USA . 1,050 parts In-Stock

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$58.467

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$58.467

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IDEA Electronic Components Group

UK . 2,342 parts In-Stock

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$59.660

100+ parts

$56.677

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$53.694

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2,342

$59.660

$56.677

$53.694

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ChromeModa Solutions

Germany . 2,300 parts In-Stock

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$59.660

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$48.921

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$59.660

$48.921

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Corphita

USA . 3,393 parts In-Stock

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Microchip USA

USA . 996 parts In-Stock

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Native Components

USA . 564 parts In-Stock

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$2.990

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564

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$2.990

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Overview

Discover the unparalleled quality and versatility of the DRA756PPIGABZQ1 by Texas Instruments, a leading manufacturer in the industry. This multi-functional peripheral offers a wide range of applications, providing customers with exceptional value and benefits. With cutting-edge technology and a compact design, this product is perfect for automotive use, ensuring high performance and reliability. Upgrade your systems with the DRA756PPIGABZQ1 and experience unmatched efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ideal for portable use.

Maximum Supply Voltage: 1.2 V

Operates efficiently within a safe voltage range, ensuring long-term reliability.

Address Bus Width: 16

Wide address bus width enables high-speed data transfer and processing capabilities.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature environments, suitable for various applications.

RAM Words: 2.5M

Large RAM capacity ensures smooth multitasking and storage of complex data.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Compatible with multiple bus technologies, enhancing connectivity and functionality.

Technical Specifications

Multi-functional Peripherals DRA756PPIGABZQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

DRA756PPIGABZQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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