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STPCV1KEBCE

STMicroelectronics

STPCV1KEBCE by STMicroelectronics

STPCV1KEBCE by STMicroelectronics is a versatile multi-functional peripheral with a 32-bit address bus and operates at a nominal voltage of 3.3 V. It features industrial-grade temperature tolerance from -40 °C to 105 °C and supports boundary scan for enhanced testing. Ideal for applications requiring reliable performance in compact designs, it comes in a square grid array package with 388 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,679

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-

-

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Anansix

USA . 2,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,689

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Digiode

USA . 897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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897

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,554 parts In-Stock

1+ parts

$52.149

100+ parts

-

1k+ parts

-

10k+ parts

-

2,554

$52.149

-

-

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IDEA Electronic Components Group

UK . 1,851 parts In-Stock

1+ parts

$69.241

100+ parts

-

1k+ parts

$62.317

10k+ parts

-

1,851

$69.241

-

$62.317

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MKK Technologies

India . 1,885 parts In-Stock

1+ parts

$130.203

100+ parts

-

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-

10k+ parts

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1,885

$130.203

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-

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DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$130.203

100+ parts

-

1k+ parts

-

10k+ parts

-

1,885

$130.203

-

-

-

Corphita

USA . 3,246 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,246

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Parana Technologies

USA . 736 parts In-Stock

1+ parts

-

100+ parts

$82.788

1k+ parts

-

10k+ parts

-

736

-

$82.788

-

-

Overview

Unlock limitless potential with the STPCV1KEBCE from STMicroelectronics, a leader in innovation and quality. This versatile multi-functional peripheral is designed for robust performance across diverse industrial applications. With its compact design and exceptional reliability, it operates seamlessly even in extreme temperatures. Experience enhanced efficiency and superior functionality, ensuring your projects are future-ready while benefiting from STMicroelectronics' trusted excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability in various environments, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, facilitating easier integration into modern electronic devices.

Maximum Supply Voltage: 3.6 V

The low maximum supply voltage contributes to energy efficiency, optimizing power usage in battery-operated systems.

Address Bus Width: 32

A 32-bit address bus allows for extensive memory addressing, enabling the device to handle larger datasets and complex operations effectively.

Package Shape: SQUARE

The square shape promotes efficient space utilization on circuit boards, making it easier to arrange multiple components.

No. of Terminals: 388

With 388 terminals, the device can support a high number of connections, facilitating versatile functionalities in multi-functional applications.

Package Style (Meter): GRID ARRAY

The grid array style enhances soldering reliability and mechanical stability, ensuring a robust connection on the PCB.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for operation in power-sensitive environments, extending battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high operating temperature capability ensures the device can perform reliably in demanding conditions, typical for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme environments, such as outdoor or unheated spaces.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient PCB layout and can improve cooling, providing better performance in high-density designs.

Maximum Seated Height: 2.38 mm

A low seated height profile enables space-saving designs in compact electronic systems, accommodating tighter packaging.

Width: 35 mm

A manageable width of 35 mm allows for versatility in placement within electronic devices, fitting well into various designs.

Boundary Scan: YES

The boundary scan feature enhances testing capabilities, facilitating easier diagnostics and quality assurance during manufacturing.

External Data Bus Width: 32

The ability to work with a 32-bit external data bus increases processing efficiency, enabling faster data transfer and operations.

Maximum Clock Frequency: 14.318 MHz

Operating at a maximum clock frequency of 14.318 MHz ensures efficient processing speeds for complex tasks in multi-functional peripherals.

Length: 35 mm

A consistent length of 35 mm complements the width, ensuring that the component fits ideally within standardized housing designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures further ensures reliability and stability in harsh operational environments, making it ideal for a variety of applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration density, ideal for multi-functional devices requiring efficient resource use.

Terminal Form: BALL

Ball terminal form enhances electrical connection reliability and supports high-density circuit board layouts.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is a common standard in electronics, ensuring compatibility with a wide range of devices and applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact layouts without compromising on connectivity, suitable for densely packed circuit boards.

Technical Specifications

Multi-functional Peripherals STPCV1KEBCE attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCV1KEBCE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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