Loading...

PSD512B1-15LI

STMicroelectronics

PSD512B1-15LI by STMicroelectronics

PSD512B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, ideal for industrial applications requiring reliability in extreme temperatures (-40 °C to 85°C). With a max clock frequency of 34.48 MHz, it supports various bus architectures like 8031 and Z80.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,933 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,933

-

-

-

-

Anansix

USA . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

650

-

-

-

-

Vyrian

USA . 530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

530

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 116 parts In-Stock

1+ parts

$40.338

100+ parts

-

1k+ parts

$36.304

10k+ parts

-

116

$40.338

-

$36.304

-

Corohmni

South Africa . 134 parts In-Stock

1+ parts

$47.581

100+ parts

-

1k+ parts

-

10k+ parts

-

134

$47.581

-

-

-

MKK Technologies

India . 692 parts In-Stock

1+ parts

$75.854

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$75.854

-

-

-

DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$75.854

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$75.854

-

-

-

Corphita

USA . 1,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,836

-

-

-

-

Parana Technologies

USA . 513 parts In-Stock

1+ parts

-

100+ parts

$48.231

1k+ parts

-

10k+ parts

-

513

-

$48.231

-

-

Overview

Elevate your designs with the PSD512B1-15LI from STMicroelectronics, a leader in cutting-edge technology. This versatile multi-functional peripheral is crafted with premium ceramic and metal-sealed materials, ensuring unmatched durability and reliability. Ideal for a range of industrial applications, it supports various architectures while delivering exceptional performance at minimal power consumption. Choose the PSD512B1-15LI for innovative solutions that drive efficiency and excellence in your projects!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures longevity and resistance against environmental factors.

Surface Mount: YES

Surface mount technology allows for smaller designs and a reduction in assembly costs.

Maximum Supply Voltage: 5.5 V

Allows compatibility with a wide range of devices operating at or below this voltage.

Address Bus Width: 16

A 16-bit address bus enables access to a larger memory space, enhancing performance for complex applications.

Package Shape: SQUARE

The square shape optimizes space on the PCB, making it suitable for compact devices.

Power Supplies (V): 5

Standard power supply makes it easy to integrate with existing systems.

No. of Terminals: 68

A higher number of terminals allows for greater connectivity and versatility in application.

Package Style (Meter): CHIP CARRIER, WINDOW

The clear window design facilitates easy visual inspection for quality assurance.

Minimum Supply Voltage: 4.5 V

Low operational voltage contributes to reduced power consumption, making it energy-efficient.

Maximum Operating Temperature: 85 C

Designed to perform reliably even in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 C

Provides exceptional performance in extreme cold, ensuring reliability in harsh conditions.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and reliability in connections.

Ultraviolet Erasable: YES

UV erase capability allows for easy reprogramming, providing flexibility for updates and changes.

Terminal Position: QUAD

Quad terminal positioning aids in space efficiency and improves routing on PCBs.

Maximum Seated Height: 4.57 mm

Low profile design suited for compact applications where space is limited.

RAM Words: 1024

Ample RAM capacity supports complex data processing and multiple simultaneous tasks.

Width: 24.105 mm

Compact width makes it suitable for a variety of multi-functional peripheral applications.

External Data Bus Width: 8

An 8-bit data bus is suitable for various data handling tasks, balancing speed and complexity.

Maximum Clock Frequency: 34.48 MHz

High clock frequency allows for fast data processing and responsiveness in applications.

Length: 24.105 mm

Standard length for ease of integration into existing designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh operating conditions.

ROM Bits Size: 512 Bits

Sufficient ROM size provides necessary firmware storage for effective device operation.

Technology: CMOS

CMOS technology is energy-efficient and is well-suited for portable and battery-operated devices.

Terminal Form: J BEND

J-bend terminals allow for easier insertion into sockets while improving mechanical stability.

Nominal Supply Voltage: 5 V

Nominal voltage provides a balanced performance combined with power efficiency.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide compatibility with various bus systems increases versatility for integration in multiple applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for compatibility with many PCB designs, simplifying assembly.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances power efficiency, prolonging battery life in portable applications.

Maximum Access Time: 0.00000015 ns

Fast access time ensures quick response and high performance in data retrieval.

No. of I/O Lines: 40

A high number of I/O lines facilitates comprehensive interfacing capabilities, enhancing functionality.

Technical Specifications

Multi-functional Peripherals PSD512B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

PSD512B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20