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CY8C4127FNI-BL483T

Infineon Technologies

CY8C4127FNI-BL483T by Infineon Technologies

CY8C4127FNI-BL483T by Infineon is a multi-functional peripheral IC with 68 terminals, operating b/w -40 to 85 °C. It features 8192 RAM words, supports I2C, SPI, UART buses and has a supply current of 25 mA. Ideal for industrial applications requiring CMOS technology in a compact grid array package style.

Median Price

$3.310

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,865 parts In-Stock

1+ parts

$6.720

100+ parts

$4.920

1k+ parts

$3.360

10k+ parts

-

1,865

$6.720

$4.920

$3.360

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Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Verical

USA . 2,000 parts In-Stock

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$1.484

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2,000

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-

$1.484

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Rochester

USA . 1,955 parts In-Stock

1+ parts

-

100+ parts

$3.310

1k+ parts

$2.960

10k+ parts

$2.780

1,955

-

$3.310

$2.960

$2.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 111 parts In-Stock

1+ parts

$3.496

100+ parts

-

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111

$3.496

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-

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Vyrian

USA . 528 parts In-Stock

1+ parts

$3.680

100+ parts

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528

$3.680

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-

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Sensible Micro Corp

USA . 1,818 parts In-Stock

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1,818

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Nova Conductors

Japan . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,875 parts In-Stock

1+ parts

$3.130

100+ parts

-

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1,875

$3.130

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Corphita

USA . 86 parts In-Stock

1+ parts

$3.312

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86

$3.312

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Corohmni

South Africa . 532 parts In-Stock

1+ parts

$76.888

100+ parts

-

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532

$76.888

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Modulus Dynamics

Lithuania . 2,199 parts In-Stock

1+ parts

$78.342

100+ parts

$75.208

1k+ parts

$72.075

10k+ parts

-

2,199

$78.342

$75.208

$72.075

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Argo Parts USA

USA . 3,446 parts In-Stock

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3,446

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Continental Prestige Electronics

USA . 2,038 parts In-Stock

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2,038

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 22 parts In-Stock

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22

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Overview

Unlock endless possibilities with the CY8C4127FNI-BL483T from Infineon Technologies. As a leading manufacturer in the industry, this multi-functional peripheral offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Experience seamless integration, high performance, and innovative features that will take your projects to the next level. Choose the CY8C4127FNI-BL483T for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material ensures durability and lightweight design, making the product easy to handle and transport.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, allowing for versatility in different operating environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, enhancing the efficiency of the device.

Bus Compatibility: I2C, SPI, UART

Multiple bus compatibility options provide flexibility in interfacing with various systems and devices.

RAM Words: 8192

Ample RAM capacity allows for efficient storage and processing of data, enhancing the overall performance of the product.

Technical Specifications

Multi-functional Peripherals CY8C4127FNI-BL483T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Boundary Scan:

NO

Bus Compatibility:

I2C, SPI, UART

JESD-30 Code:

R-PBGA-B68

JESD-609 Code:

e1

Length:

3.91 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

36

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA68,8X9,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

8192

Maximum Seated Height:

.55 mm

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.52 mm

Peripheral IC Type:

Trade Compliance

CY8C4127FNI-BL483T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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