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CY8C5867LTI-LP025

Infineon Technologies

CY8C5867LTI-LP025 by Infineon Technologies

Infineon's CY8C5867LTI-LP025 is a 68-terminal chip with 32K RAM, 1048576 ROM bits, and operates at up to 33 MHz. Ideal for industrial applications, it supports I2C, USB, and PS/2 bus compatibility. With a temperature range of -40 to 85°C, this CMOS technology device is suitable for multi-functional peripherals requiring high clock frequencies.

Median Price

$15.525

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 559 parts In-Stock

1+ parts

$28.160

100+ parts

$19.649

1k+ parts

$18.455

10k+ parts

-

559

$28.160

$19.649

$18.455

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Future Electronics

Canada . 2,340 parts In-Stock

1+ parts

-

100+ parts

-

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$12.990

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2,340

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$12.990

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Rochester

USA . 1,157 parts In-Stock

1+ parts

-

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$13.800

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$12.350

10k+ parts

$11.620

1,157

-

$13.800

$12.350

$11.620

Verical

USA . 520 parts In-Stock

1+ parts

-

100+ parts

$17.250

1k+ parts

$15.438

10k+ parts

$14.525

520

-

$17.250

$15.438

$14.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 589 parts In-Stock

1+ parts

$12.958

100+ parts

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589

$12.958

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Lonics

Poland . 5,720 parts In-Stock

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5,720

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Chip Stock

USA . 645 parts In-Stock

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645

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Vyrian

USA . 556 parts In-Stock

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556

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TME

Poland . 520 parts In-Stock

1+ parts

-

100+ parts

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$20.392

10k+ parts

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520

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-

$20.392

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

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200

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DigiKey Marketplace

USA . 65 parts In-Stock

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Sunrise Surplus Inc.

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 565 parts In-Stock

1+ parts

$11.590

100+ parts

-

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565

$11.590

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Semicontronic

India . 126 parts In-Stock

1+ parts

$11.590

100+ parts

$11.300

1k+ parts

$11.242

10k+ parts

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126

$11.590

$11.300

$11.242

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Corphita

USA . 877 parts In-Stock

1+ parts

$12.276

100+ parts

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877

$12.276

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Component Stockers USA

USA . 583 parts In-Stock

1+ parts

$15.460

100+ parts

$16.260

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583

$15.460

$16.260

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Modulus Dynamics

Lithuania . 4,197 parts In-Stock

1+ parts

$51.811

100+ parts

$49.739

1k+ parts

$47.666

10k+ parts

-

4,197

$51.811

$49.739

$47.666

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$62.991

100+ parts

$59.841

1k+ parts

$59.841

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300

$62.991

$59.841

$59.841

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Corohmni

South Africa . 2,910 parts In-Stock

1+ parts

$64.267

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2,910

$64.267

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Aztec Data Supply Inc.

USA . 1,300 parts In-Stock

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$75.912

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1,300

$75.912

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Argo Parts USA

USA . 2,330 parts In-Stock

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2,330

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Continental Prestige Electronics

USA . 761 parts In-Stock

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761

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Perfect Parts

USA . 600 parts In-Stock

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600

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Unlock the power of innovation with the CY8C5867LTI-LP025 by Infineon Technologies. This cutting-edge multi-functional peripherals device boasts exceptional quality and reliability, backed by the renowned manufacturer. Ideal for a wide range of applications, this product offers unmatched value to customers seeking versatile solutions. Experience the benefits of seamless integration, advanced performance, and unparalleled efficiency with the CY8C5867LTI-LP025. Elevate your projects to new heights with this game-changing technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for a compact design, making this product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, ensuring compatibility with various power sources.

Package Shape: SQUARE

The square package shape provides a stable and uniform mounting surface for easy integration into electronic systems.

Power Supplies (V): 2/5

Offers multiple power supply options for flexibility in different operating conditions.

No. of Terminals: 68

High terminal count allows for more connectivity options and functionality in a single device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide versatility in mounting and heat dissipation for improved performance and reliability.

Minimum Supply Voltage: 1.71 V

Works efficiently even at low supply voltages, ensuring power efficiency in operation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial environments where heat generation is a concern.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity and corrosion resistance for long-term durability.

Ultraviolet Erasable: N

Not being ultraviolet erasable ensures data security and integrity in the presence of ultraviolet light.

Terminal Position: QUAD

Quad terminal position offers more flexibility in system connections and reduces signal interference.

Maximum Seated Height: 1 mm

Low profile design with maximum seated height of 1 mm saves space and simplifies integration into compact systems.

RAM Words: 32K

Large RAM capacity of 32K words provides ample memory for storing and processing data efficiently.

Width: 8 mm

Compact width dimension enables easy fitting into tight spaces while maintaining functionality.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the device during production and operation.

Maximum Clock Frequency: 33 MHz

High clock frequency of 33 MHz enables fast data processing and communication speeds for enhanced performance.

Maximum Time At Peak Reflow Temperature (s): 30

Provides a short reflow time of 30 seconds at peak temperature, reducing the risk of component damage during reflow soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable soldering and component mounting for robust connections.

Length: 8 mm

Compact length dimension allows for easy integration and placement in space-limited electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in demanding operating conditions.

ROM Bits Size: 1048576 Bits

Large ROM capacity of 1048576 bits provides extensive storage for firmware and program code for advanced functionalities.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various electronic systems.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and promotes sustainable manufacturing practices.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8 V ensures consistent and reliable operation of the device.

Bus Compatibility: I2C; USB; PS/2

Support for multiple bus interfaces - I2C, USB, and PS/2 - allows for versatile connectivity and communication with other devices.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm enables denser packing of terminals for increased connectivity options in a compact form factor.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 ensures proper handling and storage to prevent moisture-related damage during assembly and operation.

No. of I/O Lines: 46

46 I/O lines provide ample input and output options for connecting to external devices and peripherals for enhanced functionality.

Technical Specifications

Multi-functional Peripherals CY8C5867LTI-LP025 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

32K

ROM Bits Size:

1048576 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C5867LTI-LP025 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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