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PSD513B1-15LI

STMicroelectronics

PSD513B1-15LI by STMicroelectronics

PSD513B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus architectures, and functions effectively in industrial applications from -40 °C to 85°C. Its compact design ensures efficient integration in diverse electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,471 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,471

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Anansix

USA . 2,517 parts In-Stock

1+ parts

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1k+ parts

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2,517

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Vyrian

USA . 1,507 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,507

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 948 parts In-Stock

1+ parts

$39.957

100+ parts

-

1k+ parts

$35.962

10k+ parts

-

948

$39.957

-

$35.962

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Corohmni

South Africa . 816 parts In-Stock

1+ parts

$57.772

100+ parts

-

1k+ parts

-

10k+ parts

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816

$57.772

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-

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MKK Technologies

India . 983 parts In-Stock

1+ parts

$75.137

100+ parts

-

1k+ parts

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10k+ parts

-

983

$75.137

-

-

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DigiPath Technology Company

USA . 983 parts In-Stock

1+ parts

$75.137

100+ parts

-

1k+ parts

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10k+ parts

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983

$75.137

-

-

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Corphita

USA . 3,480 parts In-Stock

1+ parts

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100+ parts

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3,480

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Parana Technologies

USA . 180 parts In-Stock

1+ parts

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100+ parts

$47.775

1k+ parts

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10k+ parts

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180

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$47.775

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Overview

Elevate your designs with the PSD513B1-15LI from STMicroelectronics—a leader in innovative multi-functional peripherals. Engineered for reliability, this high-performance solution excels in diverse applications, from automotive to industrial automation. With robust temperature tolerance and a compact ceramic package, it ensures durability even in demanding environments. Experience enhanced functionality and efficiency while enjoying the unparalleled support of a trusted manufacturer. Transform your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic body material ensures durability and reliability in various environmental conditions.

Surface Mount: YES

The surface mount capability allows for compact design and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V provides a safe operating range for various electronic systems.

Address Bus Width: 16

A 16-bit address bus width enables access to a larger memory address space, accommodating advanced applications.

Package Shape: SQUARE

The square package shape is versatile and allows for efficient use of PCB space.

Power Supplies (V): 5

Operating on a standard 5 V power supply makes it compatible with a wide range of systems.

No. of Terminals: 68

With 68 terminals, this peripheral offers extensive connectivity options for both data and control signals.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design with a window enhances visibility and accessibility for testing and troubleshooting.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation and flexibility in power supply design.

Maximum Operating Temperature: 85 °C

An operational temperature range up to 85 °C makes this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in harsh and extreme environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and enhances the longevity of connections.

Ultraviolet Erasable: Y

The ultraviolet erasable feature allows for easy reprogramming and reusability, lowering costs in production.

Terminal Position: QUAD

Quad terminal positioning allows for efficient layout and interconnectivity with surrounding components.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm contributes to a low-profile design, helping save space in enclosures.

RAM Words: 1024

With 1024 RAM words, this device supports adequate memory for complex applications and data storage.

Width: 24.105 mm

A compact width of 24.105 mm facilitates easy integration into diverse electronic layouts.

External Data Bus Width: 8

The 8-bit external data bus width supports standard interfacing with many microprocessors and systems.

Maximum Clock Frequency: 34.48 MHz

Operating at a maximum clock frequency of 34.48 MHz allows for fast processing and efficient performance.

Length: 24.105 mm

A length of 24.105 mm keeps the footprint minimal, further supporting space-efficient designs.

Temperature Grade: INDUSTRIAL

As an industrial-grade device, it is designed for reliable operation in demanding conditions.

ROM Bits Size: 1024 Bits

1024 bits of ROM size ensure sufficient storage for essential firmware and critical operations.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing overall device efficiency.

Terminal Form: J BEND

The J-bend terminal form makes handling and soldering easier, improving assembly efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is optimal for many applications, ensuring broad compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility allows seamless integration into various systems and applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports high-density layouts without compromising accessibility.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances energy efficiency, contributing to reduced operational costs.

Maximum Access Time: 0.00000015 ns

An ultra-fast access time improves the response and throughput of the peripheral in computing tasks.

No. of I/O Lines: 40

With 40 I/O lines, this device allows for versatile input/output configurations and complex interfacing.

Technical Specifications

Multi-functional Peripherals PSD513B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

128K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

PSD513B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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