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TDA2SGBRQABCRQ1

Texas Instruments

TDA2SGBRQABCRQ1 by Texas Instruments

TDA2SGBRQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 2.5M RAM words, operating at up to 38.4 MHz clock frequency. Ideal for automotive applications, it features CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB compatibility in a compact square package with 760 terminals and low power mode.

Median Price

$68.124

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,177 parts In-Stock

1+ parts

$68.124

100+ parts

$66.075

1k+ parts

$51.221

10k+ parts

-

3,177

$68.124

$66.075

$51.221

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,474 parts In-Stock

1+ parts

$64.718

100+ parts

-

1k+ parts

-

10k+ parts

-

1,474

$64.718

-

-

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Vyrian

USA . 2,812 parts In-Stock

1+ parts

-

100+ parts

-

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-

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2,812

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Electronics Depot

USA . 12 parts In-Stock

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-

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-

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12

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 141 parts In-Stock

1+ parts

$20.810

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$20.810

-

-

-

Parana Technologies

USA . 1,796 parts In-Stock

1+ parts

$36.859

100+ parts

-

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10k+ parts

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1,796

$36.859

-

-

-

IDEA Electronic Components Group

UK . 2,211 parts In-Stock

1+ parts

$41.415

100+ parts

$39.344

1k+ parts

$37.274

10k+ parts

-

2,211

$41.415

$39.344

$37.274

-

ChromeModa Solutions

Germany . 2,056 parts In-Stock

1+ parts

$41.415

100+ parts

$33.960

1k+ parts

-

10k+ parts

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2,056

$41.415

$33.960

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$55.469

100+ parts

-

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208

$55.469

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Corphita

USA . 2,585 parts In-Stock

1+ parts

$61.312

100+ parts

-

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2,585

$61.312

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-

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Microchip USA

USA . 2,282 parts In-Stock

1+ parts

$140.340

100+ parts

$137.890

1k+ parts

$136.670

10k+ parts

$135.450

2,282

$140.340

$137.890

$136.670

$135.450

Lixinc

USA . 9,450 parts In-Stock

1+ parts

-

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9,450

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,000

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

-

100+ parts

$37.340

1k+ parts

-

10k+ parts

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570

-

$37.340

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Component Stockers USA

USA . 132 parts In-Stock

1+ parts

-

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132

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Overview

Experience unmatched performance and reliability with the TDA2SGBRQABCRQ1 by Texas Instruments, a cutting-edge multi-functional peripheral designed for a wide range of applications. With a focus on quality and precision, Texas Instruments is a trusted manufacturer known for delivering top-notch products to customers worldwide. This versatile device offers unparalleled value, benefits, and advantages, making it the perfect choice for those seeking superior performance in automotive and other industrial settings. Upgrade your systems today with the TDA2SGBRQABCRQ1 and experience the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product lightweight and durable, making it easy to transport and resistant to damage.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2V ensures efficient power consumption and prevents overheating, increasing the product's lifespan.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the product can function effectively even in high-temperature environments.

RAM Words: 2.5M

The 2.5M RAM words capacity allows for fast and efficient multitasking, enhancing the product's performance.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor with RISC architecture improves processing speed and efficiency, making the product suitable for handling complex tasks.

Technical Specifications

Multi-functional Peripherals TDA2SGBRQABCRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

750 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TDA2SGBRQABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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