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TFB2002BIPPM

Texas Instruments

TFB2002BIPPM by Texas Instruments

TFB2002BIPPM by Texas Instruments is a multi-functional peripheral with 208 terminals in a square package. It operates b/w -20 to 85 °C, with a clock frequency of 25 MHz and an external data bus width of 64. Ideal for systems requiring compatibility with various buses like 680X0, 88XXX, and SPARC.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,719 parts In-Stock

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Digiode

USA . 387 parts In-Stock

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387

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Distributors (Availability)

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$4.903

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424

$4.903

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One Stop Electronics

USA . 1,168 parts In-Stock

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$28.000

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$28.000

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Corohmni

South Africa . 1,126 parts In-Stock

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$50.694

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$50.694

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Parana Technologies

USA . 1,204 parts In-Stock

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$53.219

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1,204

$53.219

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DigiPath Technology Company

USA . 774 parts In-Stock

1+ parts

$58.601

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$53.913

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774

$58.601

$53.913

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ChromeModa Solutions

Germany . 1,483 parts In-Stock

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$59.797

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$49.034

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$59.797

$49.034

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IDEA Electronic Components Group

UK . 594 parts In-Stock

1+ parts

$59.797

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$56.807

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$53.817

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594

$59.797

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$53.817

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Corphita

USA . 3,599 parts In-Stock

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Overview

Upgrade your electronics with the TFB2002BIPPM from Texas Instruments, a top-tier manufacturer known for quality and reliability. This multi-functional peripheral offers a range of applications, making it versatile for various projects. With a maximum supply voltage of 5.25V and a compact design, this product is perfect for enhancing your devices while ensuring optimal performance. Experience the value and benefits of Texas Instruments' expertise with the TFB2002BIPPM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable and long-lasting use.

Maximum Supply Voltage: 5.25 V

Allows for stable and reliable power supply to the device for consistent performance.

Address Bus Width: 36

Wide address bus width enables efficient data transfer and processing capabilities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the device can withstand extended usage without overheating.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and fast.

Technical Specifications

Multi-functional Peripherals TFB2002BIPPM attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

36

Boundary Scan:

YES

Bus Compatibility:

680X0; 88XXX; 80X86; SPARC; R4000; AXP

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

No. of I/O Lines:

0

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

TFB2002BIPPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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