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ZPSD513B1-70LI

STMicroelectronics

ZPSD513B1-70LI by STMicroelectronics

ZPSD513B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, making it ideal for industrial applications. With a max clock frequency of 36 MHz, it ensures efficient performance in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,013 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,013

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Vyrian

USA . 1,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,734

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Anansix

USA . 343 parts In-Stock

1+ parts

-

100+ parts

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343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,152 parts In-Stock

1+ parts

$71.197

100+ parts

-

1k+ parts

$64.077

10k+ parts

-

2,152

$71.197

-

$64.077

-

MKK Technologies

India . 818 parts In-Stock

1+ parts

$133.881

100+ parts

-

1k+ parts

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10k+ parts

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818

$133.881

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DigiPath Technology Company

USA . 818 parts In-Stock

1+ parts

$133.881

100+ parts

-

1k+ parts

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10k+ parts

-

818

$133.881

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Corphita

USA . 2,572 parts In-Stock

1+ parts

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2,572

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Parana Technologies

USA . 126 parts In-Stock

1+ parts

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100+ parts

$85.127

1k+ parts

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10k+ parts

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126

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$85.127

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Overview

Unlock limitless potential with the ZPSD513B1-70LI from STMicroelectronics, a leader in innovation and quality. This multi-functional peripheral seamlessly integrates into your designs, ensuring reliability across diverse applications—from industrial automation to consumer electronics. Its robust construction offers exceptional durability, while advanced features enhance performance efficiency, giving you peace of mind and unmatched value for all your project needs. Transform your ideas into reality with STMicroelectronics at your side!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Durable construction ensuring reliability and performance under various environmental conditions.

Surface Mount: YES

Enables compact design and easy integration onto printed circuit boards, saving space and simplifying manufacturing.

Maximum Supply Voltage: 5.5 V

Allows operation with a wide range of power supply options, enhancing compatibility with other components.

Address Bus Width: 16

Supports larger memory addressing, enabling efficient data handling and processing capabilities.

Package Shape: SQUARE

Facilitates better space utilization on PCB layouts compared to non-square alternatives.

Power Supplies (V): 5

Standard power supply voltage ensures compatibility with many existing systems and devices.

No. of Terminals: 68

Provides ample connection points for various functionalities, boosting flexibility in design.

Package Style (Meter): CHIP CARRIER, WINDOW

Allows for easy inspection and testing, making maintenance and troubleshooting simpler.

Minimum Supply Voltage: 4.5 V

Lower voltage requirement enhances compatibility with battery-operated devices and reduces power consumption.

Maximum Operating Temperature: 85 °C

Ideal for industrial applications where devices may be exposed to higher temperatures, ensuring stability.

Minimum Operating Temperature: -40 °C

Enables reliable operation in extreme cold environments, suitable for outdoor or harsh applications.

Terminal Finish: TIN LEAD

Offers excellent solderability and reliability, ensuring strong connections in electronic assemblies.

Ultraviolet Erasable: YES

Allows for easy data modification and updating, increasing the product's versatility.

Terminal Position: QUAD

Facilitates easy mounting and integration into various board layouts, enhancing user experience.

Maximum Seated Height: 4.57 mm

Compact design helps to reduce the overall height of the assembly, fitting into tighter spaces.

RAM Words: 1024

Provides sufficient memory capacity for robust applications, supporting complex data processes.

Width: 24.105 mm

Standard width allows for compatibility with commonly used PCB layouts, easing design efforts.

External Data Bus Width: 8

Supports efficient data handling with an adequate data transmission rate for most applications.

Maximum Clock Frequency: 36 MHz

Higher frequency facilitates faster processing speeds, improving overall system performance.

Length: 24.105 mm

Similar to width, this standard length promotes compatibility with standard circuit board designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh conditions, ensuring reliable operation in industrial environments.

ROM Bits Size: 1024 Bits

Provides sufficient storage for firmware, supporting a wide range of functionalities.

Technology: CMOS

Ensures low power consumption and high noise immunity, making it energy efficient and effective.

Terminal Form: J BEND

Facilitates easy connections and soldering to PCB, simplifying assembly processes.

Nominal Supply Voltage: 5 V

Common voltage level providing ease of integration into existing systems without additional design adjustments.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide range of compatibility with various bus architectures, making it suitable for diverse applications.

Terminal Pitch: 1.27 mm

Standard pitch aids in maintaining good spacing between terminals for reliable soldering and connection.

Maximum Standby Current: 0.00002 Amp

Very low standby current improves energy efficiency, ideal for power-sensitive applications.

Maximum Access Time: 0.00000007 ns

Fast access time enhances performance, critical for applications requiring quick response times.

No. of I/O Lines: 40

Ample I/O lines support a variety of peripheral connections, increasing the device's functionality.

Technical Specifications

Multi-functional Peripherals ZPSD513B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD513B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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