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PSD503B1-70L

STMicroelectronics

PSD503B1-70L by STMicroelectronics

PSD503B1-70L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded systems. Its ceramic, metal-sealed package ensures durability in commercial applications up to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,291 parts In-Stock

1+ parts

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4,291

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Digiode

USA . 3,114 parts In-Stock

1+ parts

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3,114

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Anansix

USA . 2,540 parts In-Stock

1+ parts

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2,540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 737 parts In-Stock

1+ parts

$14.266

100+ parts

-

1k+ parts

$12.840

10k+ parts

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737

$14.266

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$12.840

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MKK Technologies

India . 2,359 parts In-Stock

1+ parts

$26.827

100+ parts

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2,359

$26.827

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DigiPath Technology Company

USA . 2,359 parts In-Stock

1+ parts

$26.827

100+ parts

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2,359

$26.827

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Corohmni

South Africa . 27 parts In-Stock

1+ parts

$83.393

100+ parts

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27

$83.393

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Corphita

USA . 4,377 parts In-Stock

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4,377

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Parana Technologies

USA . 663 parts In-Stock

1+ parts

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100+ parts

$17.058

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663

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$17.058

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Overview

Unlock unparalleled versatility with the PSD503B1-70L from STMicroelectronics, a trusted leader in innovative multi-functional peripherals. Designed for superior performance in demanding applications, this robust chip delivers reliability and efficiency, making it ideal for everything from consumer electronics to industrial automation. Experience enhanced functionality and seamless integration—boost your projects with STMicroelectronics' commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The robust ceramic and metal-sealed co-fired package ensures durability and reliability, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of assembly, enhancing the product's versatility for modern applications.

Maximum Supply Voltage: 5.5 V

The versatile maximum supply voltage supports a range of operating conditions, ensuring compatibility with various systems.

Address Bus Width: 16

A 16-bit address bus width enables efficient data handling and higher memory addressing capability, crucial for performance-intensive applications.

Package Shape: SQUARE

The square package shape is conventional and allows for easier integration into different electronic designs.

No. of Terminals: 68

With 68 terminals, this product provides ample connectivity options, facilitating intricate circuit designs.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with a window allows for optical inspection and easy access to the chip, enhancing maintenance and troubleshooting.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage ensures reliable operation even in lower power scenarios, making it energy efficient.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suited for operation in higher temperature environments, ensuring reliability under stress.

Minimum Operating Temperature: 0 °C

Operational from 0 °C, this product can be deployed in a variety of conditions without risking performance degradation.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and design, allowing for more efficient space utilization.

Maximum Seated Height: 4.57 mm

A low seated height aids in maintaining a compact design footprint, which is essential for modern, space-constrained electronics.

RAM Words: 512

With 512 RAM words, the product can handle substantial data processing needs, proving advantageous for applications that require fast data access.

Width: 24.105 mm

The width of 24.105 mm is compatible with standard PCB designs, ensuring ease of integration.

External Data Bus Width: 16

A 16-bit external data bus width supports efficient data transfer rates, crucial for real-time applications.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz allows for higher processing speeds, enhancing overall system performance.

Length: 24.105 mm

The length matches the width, maintaining a compact square form factor, conducive for high-density applications.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures that this product is suitable for a wide range of consumer electronics.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high speed, making it efficient for battery-operated devices.

Terminal Form: J BEND

J-bend terminals simplify mounting and improve mechanical stability on the PCB.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in the industry, promoting compatibility with numerous systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

The extensive bus compatibility allows for integration into various legacy and modern systems, providing flexibility in design and application.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch makes this product compatible with various PCB layouts, facilitating ease of manufacturing.

No. of I/O Lines: 40

With 40 I/O lines, this product provides significant input/output capabilities, useful for complex interfacing requirements.

Technical Specifications

Multi-functional Peripherals PSD503B1-70L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD503B1-70L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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