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ZPSD512B1-15LI

STMicroelectronics

ZPSD512B1-15LI by STMicroelectronics

ZPSD512B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85 °C. Its compact design makes it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,941 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,941

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-

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Vyrian

USA . 2,317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,317

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Anansix

USA . 1,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,136

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 649 parts In-Stock

1+ parts

$58.872

100+ parts

-

1k+ parts

$52.985

10k+ parts

-

649

$58.872

-

$52.985

-

MKK Technologies

India . 509 parts In-Stock

1+ parts

$110.704

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$110.704

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-

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DigiPath Technology Company

USA . 509 parts In-Stock

1+ parts

$110.704

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$110.704

-

-

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Corphita

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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4,500

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Parana Technologies

USA . 2,117 parts In-Stock

1+ parts

-

100+ parts

$70.390

1k+ parts

-

10k+ parts

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2,117

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$70.390

-

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Overview

Unlock unparalleled performance with the ZPSD512B1-15LI from STMicroelectronics, a leader in innovative semiconductor solutions. This multi-functional peripheral is designed for versatility and reliability in demanding applications, ensuring robust operation across diverse environments. With its compact package and exceptional power efficiency, it seamlessly integrates into your designs, offering unmatched value and cutting-edge technology. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and thermal stability, making it suitable for demanding environments.

Surface Mount: YES

The surface mount technology facilitates compact designs and is ideal for modern circuit layouts.

Maximum Supply Voltage: 5.5 V

This allows for compatibility with a wide range of power supply systems while ensuring safe operation.

Address Bus Width: 16

A 16-bit address bus width enables more extensive memory addressing, improving system performance.

Package Shape: SQUARE

The square shape optimizes space utilization on PCBs, making it efficient for various applications.

Power Supplies (V): 5

Standard 5V power supply makes integration simple in existing systems.

No. of Terminals: 68

With 68 terminals, the device supports extensive connections, enhancing its versatility in designs.

Package Style (Meter): CHIP CARRIER, WINDOW

This design promotes easy access and inspection of connection points, aiding in troubleshooting.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage ensures reliability in various power conditions.

Maximum Operating Temperature: 85 °C

The high temperature tolerance makes it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

This wide temperature range enhances reliability in extreme conditions.

Terminal Finish: TIN LEAD

This finish ensures good solderability and long-lasting connections under various conditions.

Ultraviolet Erasable: Y

This feature offers flexible data storage capabilities, enhancing adaptability in applications.

Terminal Position: QUAD

The quad positioning simplifies PCB layout and improves assembly efficiency.

Maximum Seated Height: 4.57 mm

The low height optimizes space, allowing for more compact designs.

RAM Words: 1024

With 1024 RAM words, the device can handle complex operations and multitasking efficiently.

Width: 24.105 mm

The compact width supports dense PCB designs without sacrificing performance.

External Data Bus Width: 8

This allows interactions with standard 8-bit data buses, maintaining compatibility with numerous devices.

Maximum Clock Frequency: 34.48 MHz

The high clock frequency enhances processing speed, suitable for demanding applications.

Length: 24.105 mm

Combined with its width, this length allows for efficient space usage in our product design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in challenging environments.

ROM Bits Size: 512 Bits

512 bits of ROM ensures adequate storage for essential firmware and configuration.

Technology: CMOS

CMOS technology delivers low power consumption and high noise immunity.

Terminal Form: J BEND

J bend terminals provide excellent mechanical stability and soldering benefits.

Nominal Supply Voltage: 5 V

5V nominal supply is a standard, simplifying power integration into existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility enhances interoperability with various legacy and modern systems.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for high-density layout without compromising performance.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances efficiency and prolongs battery life in portable applications.

Maximum Access Time: 0.00000015 ns

Fast access time ensures swift response and high-speed operation, vital for performance-sensitive tasks.

No. of I/O Lines: 40

40 I/O lines provide ample connectivity options, making it suitable for diverse applications.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD512B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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