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PSD503B1-70LI

STMicroelectronics

PSD503B1-70LI by STMicroelectronics

PSD503B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 5.5V and operates within -40 °C to 85°C. It features a 16-bit address bus and supports various bus types, making it ideal for industrial applications. Its compact ceramic package ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,676 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,676

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-

-

-

Digiode

USA . 3,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,208

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-

-

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Anansix

USA . 2,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,458 parts In-Stock

1+ parts

$71.904

100+ parts

-

1k+ parts

$64.714

10k+ parts

-

1,458

$71.904

-

$64.714

-

MKK Technologies

India . 2,068 parts In-Stock

1+ parts

$135.212

100+ parts

-

1k+ parts

-

10k+ parts

-

2,068

$135.212

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-

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DigiPath Technology Company

USA . 2,068 parts In-Stock

1+ parts

$135.212

100+ parts

-

1k+ parts

-

10k+ parts

-

2,068

$135.212

-

-

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Corphita

USA . 3,683 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,683

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-

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Parana Technologies

USA . 1,234 parts In-Stock

1+ parts

-

100+ parts

$85.973

1k+ parts

-

10k+ parts

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1,234

-

$85.973

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Overview

Elevate your designs with the PSD503B1-70LI from STMicroelectronics, a leader in innovation and reliability. This multi-functional peripheral is engineered for excellence, delivering robust performance across diverse applications, from industrial automation to consumer electronics. Its superior quality ensures longevity, while its advanced capabilities simplify integration, empowering you to create more efficient and powerful solutions. Invest in the PSD503B1-70LI and transform your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of durable materials like ceramic and metal sealing enhances the reliability and longevity of the device, making it suitable for various demanding environments.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on circuit boards, making this multi-functional peripheral ideal for modern electronic applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product offers flexibility in power supply design while ensuring safety and performance.

Address Bus Width: 16

A 16-bit address bus width provides a large address space for accommodating complex data handling and processing, making the device well-suited for advanced applications.

Package Shape: SQUARE

The square package shape optimizes space efficiency and simplifies PCB layout, allowing for better integration into various designs.

No. of Terminals: 68

With 68 terminals, this device offers ample connectivity options for multiple input/output configurations, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with a window feature facilitates easy monitoring and access to the chip, which is beneficial for testing and debugging.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with a wide range of power supplies, making this peripheral adaptable to various systems.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the device to function effectively in high-temperature environments, enhancing its usability in industrial settings.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C makes this product suitable for extreme environmental conditions, ensuring reliability and performance.

Terminal Position: QUAD

Quad terminal positioning allows for efficient heat dissipation and improved electrical performance, contributing to the device’s overall effectiveness.

Maximum Seated Height: 4.57 mm

A low seated height of 4.57 mm allows for a compact footprint on PCBs, enabling more design flexibility and minimizing space usage.

RAM Words: 512

With 512 RAM words, this device provides sufficient memory for processing tasks, enhancing its performance in various applications.

Width: 24.105 mm

The width of 24.105 mm balances performance with compact design, allowing for integration into space-constrained environments.

External Data Bus Width: 16

A 16-bit external data bus width facilitates efficient data transfer rates, making this peripheral a powerful choice for high-speed applications.

Maximum Clock Frequency: 36 MHz

Operating at a maximum clock frequency of 36 MHz ensures rapid processing capabilities, which is crucial for performance-intensive applications.

Length: 24.105 mm

At a length of 24.105 mm, the product maintains a compact structure while providing robust functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this product meets stringent operational requirements, making it ideal for industrial applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, providing an efficient and effective solution for various electronic needs.

Terminal Form: J BEND

The J bend terminal form allows for easier soldering and increased reliability in electrical connections, enhancing overall performance.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronic systems, ensuring broad compatibility and ease of integration.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

The wide range of bus compatibility makes this device a versatile choice, allowing it to work with various architectures and application platforms.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates easier PCB design and assembly, supporting efficient manufacturing processes.

No. of I/O Lines: 40

With 40 I/O lines, this product can interface with multiple peripherals, enhancing its functionality and operational capability.

Technical Specifications

Multi-functional Peripherals PSD503B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD503B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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