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PSD513B1-90JI

STMicroelectronics

PSD513B1-90JI by STMicroelectronics

PSD513B1-90JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It supports up to 1024 RAM words, features a max clock frequency of 30 MHz, and functions in industrial applications from -40 °C to 85°C. Ideal for various microcontroller systems, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,941 parts In-Stock

1+ parts

-

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4,941

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Vyrian

USA . 3,611 parts In-Stock

1+ parts

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-

1k+ parts

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3,611

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Anansix

USA . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 117 parts In-Stock

1+ parts

$23.671

100+ parts

-

1k+ parts

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10k+ parts

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117

$23.671

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

1+ parts

$34.455

100+ parts

-

1k+ parts

$31.009

10k+ parts

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2,281

$34.455

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$31.009

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MKK Technologies

India . 1,251 parts In-Stock

1+ parts

$64.790

100+ parts

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1,251

$64.790

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DigiPath Technology Company

USA . 1,251 parts In-Stock

1+ parts

$64.790

100+ parts

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1,251

$64.790

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Parana Technologies

USA . 1,975 parts In-Stock

1+ parts

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100+ parts

$41.196

1k+ parts

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1,975

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$41.196

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Corphita

USA . 891 parts In-Stock

1+ parts

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891

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Overview

Experience unparalleled performance with the PSD513B1-90JI from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile multi-functional peripheral is designed for a broad range of applications, ensuring reliability in demanding industrial environments. Its compact package and robust temperature range enhance efficiency, making it perfect for your next project. Trust in STMicroelectronics to deliver cutting-edge technology that elevates your designs and drives innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures longevity and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration onto PCBs, optimizing space in multi-functional peripheral devices.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage provides enhanced flexibility in power supply options for various operating conditions.

Address Bus Width: 16

A 16-bit address bus width allows for a larger memory addressing capability, enabling the product to support more extensive functionalities.

Package Shape: SQUARE

The square shape facilitates efficient layout planning on PCBs, which is particularly beneficial in high-density designs.

No. of Terminals: 68

With 68 terminals, this device can accommodate more connections, allowing for versatile configurations and enhanced functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier style offers good thermal management and electrical performance, making it suitable for industrial applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V enables operation in a wider range of power supply conditions, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this peripheral ideal for use in harsh environments.

Minimum Operating Temperature: -40 °C

This low operating temperature offers versatility in diverse environments, ensuring reliability even in extreme conditions.

Terminal Position: QUAD

Quad terminal positioning allows for effective signal integrity and reduces trace lengths, improving performance and reliability.

Maximum Seated Height: 4.57 mm

A low seated height allows for efficient space utilization within compact electronic assemblies.

RAM Words: 1024

With 1024 RAM words, this product has sufficient memory for various data processing tasks, enhancing its performance in applications.

Width: 24.1808 mm

The compact width contributes to space-saving designs in multi-functional peripherals, allowing for more functionality in smaller footprints.

External Data Bus Width: 8

An 8-bit external data bus width supports a balance between performance and system complexity, making it easier to integrate with various architectures.

Maximum Clock Frequency: 30 MHz

A maximum clock frequency of 30 MHz allows for faster processing speeds, ensuring efficient data handling and quicker response times in applications.

Length: 24.1808 mm

The length complements the width, maintaining a square profile which is advantageous for thermal efficiency and ease of layout.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that the product can perform reliably in demanding operating environments, enhancing its applications in industrial settings.

Technology: CMOS

CMOS technology is known for its low power consumption and high speed, making this peripheral energy-efficient and suitable for battery-powered devices.

Terminal Form: J BEND

The J bend terminals provide strong mechanical stability and reliability in connections, enhancing the durability of the device.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V is common in many electronic devices, making it easy to integrate with existing systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility ensures that this peripheral can seamlessly integrate with a variety of existing systems and technologies, enhancing its adaptability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm supports dense PCB layouts while maintaining reliable solder joint strength, critical for high-reliability applications.

No. of I/O Lines: 40

Having 40 I/O lines provides extensive interfacing capabilities, allowing for versatile communication and control options in multi-functional peripherals.

Technical Specifications

Multi-functional Peripherals PSD513B1-90JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD513B1-90JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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