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XDRA777PSIGACD

Texas Instruments

XDRA777PSIGACD by Texas Instruments

XDRA777PSIGACD by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and 38.4 MHz max clock frequency. Ideal for automotive applications, it features AEC-Q100 screening level and supports CAN, Ethernet, I2C, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,647 parts In-Stock

1+ parts

-

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8,647

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Digiode

USA . 1,613 parts In-Stock

1+ parts

-

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1k+ parts

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1,613

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$17.043

100+ parts

-

1k+ parts

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10k+ parts

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431

$17.043

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One Stop Electronics

USA . 943 parts In-Stock

1+ parts

$29.000

100+ parts

-

1k+ parts

-

10k+ parts

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943

$29.000

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Corohmni

South Africa . 4,868 parts In-Stock

1+ parts

$49.413

100+ parts

-

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10k+ parts

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4,868

$49.413

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Parana Technologies

USA . 1,174 parts In-Stock

1+ parts

$71.585

100+ parts

-

1k+ parts

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10k+ parts

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1,174

$71.585

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ChromeModa Solutions

Germany . 4,615 parts In-Stock

1+ parts

$80.433

100+ parts

$65.955

1k+ parts

-

10k+ parts

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4,615

$80.433

$65.955

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IDEA Electronic Components Group

UK . 2,204 parts In-Stock

1+ parts

$80.433

100+ parts

$76.411

1k+ parts

$72.390

10k+ parts

-

2,204

$80.433

$76.411

$72.390

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Corphita

USA . 1,791 parts In-Stock

1+ parts

-

100+ parts

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1,791

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DigiPath Technology Company

USA . 1,017 parts In-Stock

1+ parts

-

100+ parts

$72.518

1k+ parts

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10k+ parts

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1,017

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$72.518

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Overview

Experience unparalleled performance and reliability with the XDRA777PSIGACD by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality multi-functional peripherals that cater to a wide range of applications. With cutting-edge technology and innovative design, this product offers customers exceptional value and benefits. From automotive to industrial use, the XDRA777PSIGACD provides seamless integration and optimal functionality. Trust in Texas Instruments for all your peripheral needs and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material provides a lightweight and durable construction for the product.

Maximum Supply Voltage: 1.2 V

Allows for efficient power usage and compatibility with various power sources.

Surface Mount: YES

Enables easy installation and integration of the product onto circuit boards.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Width: 23 mm

Compact size makes the product suitable for space-constrained applications.

Technical Specifications

Multi-functional Peripherals XDRA777PSIGACD attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B784

Length:

23 mm

No. of I/O Lines:

247

No. of Terminals:

784

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

XDRA777PSIGACD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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