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AF82801IBMSLB8Q

Intel

AF82801IBMSLB8Q by Intel

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: NO;

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Inventory MP

USA . 2,130 parts In-Stock

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Bristol Electronics

USA . 2,099 parts In-Stock

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Digiode

USA . 464 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 144 parts In-Stock

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Vyrian

USA . 130 parts In-Stock

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Sensible Micro Corp

USA . 45 parts In-Stock

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45

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 8 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 4,666 parts In-Stock

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$9.774

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$9.383

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$9.383

4,666

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$9.383

Corohmni

South Africa . 967 parts In-Stock

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$30.273

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MARBEL Systems

Belgium . 497 parts In-Stock

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$71.694

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$68.826

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Texas Native Microelectronics

USA . 1,885 parts In-Stock

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$82.407

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$79.111

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$76.639

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Kenton Components

USA . 34 parts In-Stock

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$98.888

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$87.022

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Lixinc

USA . 12,331 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,500 parts In-Stock

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Assy Fe

Spain . 1,529 parts In-Stock

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Qasali Group International

UK . 311 parts In-Stock

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$213.599

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$195.799

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Kepictronics

USA . 250 parts In-Stock

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Corphita

USA . 229 parts In-Stock

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GreenTree Electronics

Israel . 166 parts In-Stock

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Technical Specifications

Multi-functional Peripherals AF82801IBMSLB8Q attributes and parameters. Explore more Multi-functional Peripherals devices from Intel

Specs

Boundary Scan:

NO

Bus Compatibility:

PCI; USB; LPC

JESD-30 Code:

S-PBGA-B676

No. of Terminals:

676

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,29X29,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.05,1.5,3.3,5

Qualification:

Not Qualified

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Current:

308 mA

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

AF82801IBMSLB8Q Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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