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AF82801JDO

Intel

AF82801JDO by Intel

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 375 parts In-Stock

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375

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Digiode

USA . 368 parts In-Stock

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368

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,447 parts In-Stock

1+ parts

$4.713

100+ parts

-

1k+ parts

$4.525

10k+ parts

$4.525

2,447

$4.713

-

$4.525

$4.525

Ampacity Inc.

Singapore . 198 parts In-Stock

1+ parts

$35.000

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198

$35.000

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Corohmni

South Africa . 293 parts In-Stock

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$39.963

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293

$39.963

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MARBEL Systems

Belgium . 4,514 parts In-Stock

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$47.013

100+ parts

$45.133

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4,514

$47.013

$45.133

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Texas Native Microelectronics

USA . 2,199 parts In-Stock

1+ parts

$54.038

100+ parts

$51.876

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2,199

$54.038

$51.876

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Kenton Components

USA . 485 parts In-Stock

1+ parts

$64.846

100+ parts

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$57.064

485

$64.846

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$57.064

Kepictronics

USA . 2,470 parts In-Stock

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2,470

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Assy Fe

Spain . 2,470 parts In-Stock

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2,470

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Qasali Group International

UK . 2,159 parts In-Stock

1+ parts

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100+ parts

$140.066

1k+ parts

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10k+ parts

$128.394

2,159

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$140.066

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$128.394

Corphita

USA . 356 parts In-Stock

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356

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Technical Specifications

Multi-functional Peripherals AF82801JDO attributes and parameters. Explore more Multi-functional Peripherals devices from Intel

Specs

Additional Features:

PITCH_MINI

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; I2C

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B676

Length:

31 mm

No. of Terminals:

676

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA676,30X30,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1,1.5,3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

2.49 mm

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

31 mm

Trade Compliance

AF82801JDO Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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