Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 404; Package Code: LFBGA; Package Shape: SQUARE;
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Multi-functional Peripherals MCIMX27LVOP4AR2 attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors
Additional Features:
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MCIMX27LVOP4AR2 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
1N4148
Wuxi Xuyang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
OPA2227UA
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
BAV99
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR130T1G
Onsemi
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
General Transistor
AT90CAN128-16AU
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
Digitron Semiconductors
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
PSD501B1-70L
PSD501B1-70L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded systems. Its ceramic, metal-sealed package ensures durability in commercial applications.
CY8C5268AXI-LP047
Cypress Semiconductor
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
MIMX8QX6CVLFZAC
NXP Semiconductors
Multifunction Peripherals; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
CY8C4127AXI-S443
Infineon Technologies
MULTIFUNCTION PERIPHERAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
CY8C4124PVI-442T
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
DRA767PSIGACDRQ1
DRA767PSIGACDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it features a low profile grid array package style with 784 terminals and operates in temperatures ranging from -40 to 125°C.
ZPSD502B1-70U
ZPSD502B1-70U by STMicroelectronics is a versatile 80-terminal CMOS peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It supports multiple bus types, making it ideal for embedded systems. With a max clock frequency of 50 MHz, it's perfect for high-speed applications.
DRA404BIZDU
MULTIFUNCTION PERIPHERAL;
CY8C5867LTI-LP025
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
DRF404HSIZDU
DRI404HSBIPTP
STA2065N
STA2065N by STMicroelectronics is a multi-functional peripheral IC with 32K RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports CAN, I2C, I2S, SPI, SSP, UART USB bus compatibility. The package style is grid array with thin profile and fine pitch terminals for surface mount applications.
LS1026ASN8P1A
LS1026ASN8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 1400 MHz max clock frequency, and 780 terminals. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact square package with a terminal pitch of 0.8 mm.
CY8C4146LQI-S432T
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CY8C4124AXI-443
CY8C4124AXI-443 by Infineon is a 44-terminal IC with 2048 RAM words, operating at up to 24 MHz. It is ideal for industrial applications requiring I2C, I2S, SPI, and UART bus compatibility in a compact square package with low profile design. With a wide temperature range of -40 to 85°C and low supply voltage of 1.71V, it offers versatile performance for various multi-functional peripheral tasks.
DRE404HSIPTP
CY8C5468AXI-LP106
CY8C5468AXI-LP106 by Infineon is a multi-functional peripheral with 5.5V max supply voltage, 33MHz clock frequency, and 32768 RAM words. Ideal for industrial applications requiring I2C, USB, PS/2 bus compatibility in a compact 14mm square package with 100 terminals and -40 to 85°C operating temperature range.
CY8C24423A-24PXI
CY8C24423A-24PXI by Cypress Semiconductor is an 8-bit MCU with 4096 ROM words and 256 RAM bytes. Operating at a max frequency of 24.6 MHz, it's ideal for industrial applications requiring USB bus compatibility and a wide temperature range from -40 to 85°C.
ZPSD501B1V-20UI
ZPSD501B1V-20UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates b/w 2.7V to 5.5V. It features a max clock frequency of 33.33 MHz and supports various bus architectures, making it ideal for industrial applications. Its compact flatpack design ensures efficient space utilization in electronic systems.
MCIMX6G3DVM05AA
Freescale Semiconductor
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
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MCIMX535DVV1CR2
Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
MCIMX535DVV2C
MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.
MCIMX6Q5EYM10ADR
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MCIMX6Q5EYM10ACR
MCIMX6Q5EYM10ACR by NXP Semiconductors is a multi-functional peripheral with integrated cache and surface mount capability. It has a max supply voltage of 1.5V and is commonly used in applications such as grid arrays, heat sinks, and bottom terminal positions.
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
MCIMX6Q5EYM12AC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MCIMX257CJM4AR2
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM12AD
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6Q6AVT10ACR
MULTIFUNCTION PERIPHERAL; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 40; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCIMX6Q5EYM10AE
Multifunction Peripherals; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MCIMX6G2AVM07AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX351AJQ5C
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX357CJQ5CR2
MCIMX6G2DVM05AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX356AJQ5C
MCIMX356AJQ5CR2
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER OVER NICKEL; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCIMX6Y0DVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y0CVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
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