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MCIMX27LVOP4AR2

NXP Semiconductors

MCIMX27LVOP4AR2 by NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 404; Package Code: LFBGA; Package Shape: SQUARE;

Median Price

$19.766

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MCIMX27LVOP4AR2 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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$19.766

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10,000

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$19.766

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Distributors (In-Stock)

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Anansix

USA . 2,839 parts In-Stock

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Vyrian

USA . 2,120 parts In-Stock

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Flip Electronics

USA . 2,000 parts In-Stock

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Chip Stock

USA . 845 parts In-Stock

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845

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Digiode

USA . 437 parts In-Stock

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437

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Distributors (Availability)

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One Stop Electronics

USA . 1,244 parts In-Stock

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$11.000

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Ampacity Inc.

Singapore . 467 parts In-Stock

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$29.000

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$29.000

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Corohmni

South Africa . 52 parts In-Stock

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$46.826

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52

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Component Stockers USA

USA . 373 parts In-Stock

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$182.260

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,037 parts In-Stock

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Corphita

USA . 3,263 parts In-Stock

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UNI Independent Distributors

Spain . 3,244 parts In-Stock

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Microchip USA

USA . 2,823 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Technical Specifications

Multi-functional Peripherals MCIMX27LVOP4AR2 attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES 1.3V AT 266MHZ

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B404

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

404

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.52 V

Minimum Supply Voltage:

1.38 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCIMX27LVOP4AR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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