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PSD512B1-15U

STMicroelectronics

PSD512B1-15U by STMicroelectronics

PSD512B1-15U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features low-profile packaging, ideal for compact applications, and supports various bus types. With a max clock frequency of 34.48 MHz, it’s perfect for high-speed data processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,842

-

-

-

-

Anansix

USA . 675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

675

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-

-

-

Vyrian

USA . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

660

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,047 parts In-Stock

1+ parts

$24.311

100+ parts

-

1k+ parts

-

10k+ parts

-

5,047

$24.311

-

-

-

IDEA Electronic Components Group

UK . 828 parts In-Stock

1+ parts

$29.758

100+ parts

-

1k+ parts

$26.782

10k+ parts

-

828

$29.758

-

$26.782

-

MKK Technologies

India . 2,003 parts In-Stock

1+ parts

$55.959

100+ parts

-

1k+ parts

-

10k+ parts

-

2,003

$55.959

-

-

-

DigiPath Technology Company

USA . 2,003 parts In-Stock

1+ parts

$55.959

100+ parts

-

1k+ parts

-

10k+ parts

-

2,003

$55.959

-

-

-

Corphita

USA . 2,095 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,095

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-

-

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Parana Technologies

USA . 1,856 parts In-Stock

1+ parts

-

100+ parts

$35.581

1k+ parts

-

10k+ parts

-

1,856

-

$35.581

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Overview

Elevate your projects with the PSD512B1-15U from STMicroelectronics—your go-to solution for multi-functional peripherals. Renowned for their innovation and quality, STMicroelectronics delivers this compact, low-profile device that ensures seamless integration and reliable performance across various applications. Experience the benefits of enhanced functionality and adaptability, designed to meet the demands of modern electronics without compromising on efficiency or reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials enhance performance and reliability.

Surface Mount: YES

Allows for compact design and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options and prevents over-voltage damage.

Address Bus Width: 16

Supports extensive memory addressing, enabling more complex applications.

Package Shape: SQUARE

Efficient shape for uniform heat distribution and optimized circuit board layout.

Power Supplies (V): 5

Standard voltage enables compatibility with a wide range of equipment.

No. of Terminals: 80

Provides ample connection options for various input/output configurations.

Package Style (Meter): FLATPACK, LOW PROFILE

Ideal for space-constrained designs and enhances airflow in electronic setups.

Minimum Supply Voltage: 4.5 V

Ensures stable performance in variable power conditions.

Maximum Operating Temperature: 70 °C

Ability to operate in high-temperature environments makes it suitable for diverse applications.

Minimum Operating Temperature: 0 °C

Versatile operation across a wide temperature range ensures reliability.

Terminal Finish: TIN LEAD

Provides good solderability and corrosion resistance for long-lasting connections.

Ultraviolet Erasable: N

Non-erasable memory enhances data security and integrity.

Terminal Position: QUAD

Facilitates easier mounting and connection within circuit designs.

Maximum Seated Height: 1.6 mm

Low profile allows for compact designs that fit in tight spaces.

RAM Words: 1024

Sufficient RAM capacity for various applications, allowing for efficient data processing.

Width: 14 mm

Compact width is perfect for space-saving designs.

External Data Bus Width: 8

Allows for efficient data transfer suitable for various applications.

Maximum Clock Frequency: 34.48 MHz

High clock speed enables faster processing and performance in demanding applications.

Length: 14 mm

Compact length facilitates placement in smaller device enclosures.

Temperature Grade: COMMERCIAL

Suitable for general commercial applications requiring reliable performance.

ROM Bits Size: 512 Bits

Adequate ROM for firmware storage, ensuring efficient operation of the device.

Technology: CMOS

Low power consumption and high noise immunity make it ideal for portable devices.

Terminal Form: GULL WING

Easier access and connection for surface mount applications, promoting efficient PCB layout.

Nominal Supply Voltage: 5 V

Standard voltage simplifies integration with many electronic systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide compatibility with various microcontrollers increases versatility in applications.

Terminal Pitch: 0.65 mm

Fine pitch reduces PCB space usage, ideal for dense layouts.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current increases energy efficiency, prolonging battery life in portable applications.

Maximum Access Time: 0.00000015 ns

Fast access time ensures quick information retrieval, enhancing overall system responsiveness.

No. of I/O Lines: 40

Provides sufficient I/O options for various peripherals, enabling comprehensive functionality.

Technical Specifications

Multi-functional Peripherals PSD512B1-15U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

64K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD512B1-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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