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ZPSD503B1-90UI

STMicroelectronics

ZPSD503B1-90UI by STMicroelectronics

ZPSD503B1-90UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 30 MHz, 512 RAM words, and supports various bus types. Ideal for industrial applications due to its wide temp range (-40 °C to 85 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,743 parts In-Stock

1+ parts

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3,743

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Anansix

USA . 2,276 parts In-Stock

1+ parts

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1k+ parts

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2,276

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Vyrian

USA . 711 parts In-Stock

1+ parts

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711

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,592 parts In-Stock

1+ parts

$68.259

100+ parts

-

1k+ parts

$61.433

10k+ parts

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1,592

$68.259

-

$61.433

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MKK Technologies

India . 1,273 parts In-Stock

1+ parts

$128.357

100+ parts

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1,273

$128.357

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DigiPath Technology Company

USA . 1,273 parts In-Stock

1+ parts

$128.357

100+ parts

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1,273

$128.357

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Parana Technologies

USA . 1,228 parts In-Stock

1+ parts

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100+ parts

$81.614

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1,228

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$81.614

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Corphita

USA . 1,223 parts In-Stock

1+ parts

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1,223

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Overview

Unlock the potential of your projects with the ZPSD503B1-90UI from STMicroelectronics—a leader in innovative semiconductor solutions. This versatile multi-functional peripheral delivers unmatched quality and reliability, ideal for industrial applications where performance matters most. With its compact design and exceptional power efficiency, you can enhance system capabilities while minimizing space. Choose STMicroelectronics for cutting-edge technology that drives success and innovation in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure the longevity and reliability of the product.

Surface Mount: YES

Facilitates easy and efficient integration onto printed circuit boards, enhancing assembly speed.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of operating conditions, providing flexibility for various applications.

Address Bus Width: 16

Offers substantial addressing capability, making it suitable for complex operations.

Package Shape: SQUARE

Optimizes space utilization on circuit boards while maintaining structural integrity.

Power Supplies (V): 5

Common voltage usage simplifies design and power supply configurations.

No. of Terminals: 80

Enables diverse connectivity options for peripherals and other components.

Package Style (Meter): FLATPACK, LOW PROFILE

Facilitates compact designs and enhances compatibility with space-constrained applications.

Minimum Supply Voltage: 4.5 V

Provides flexibility in power supply choice, accommodating various system requirements.

Maximum Operating Temperature: 85 °C

Ensures reliability and performance in higher temperature environments, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Supports operation in extreme conditions, making it suitable for harsh environments.

Terminal Finish: TIN LEAD

Improves solderability and prevents corrosion, ensuring better electrical connections.

Terminal Position: QUAD

Provides efficient layout and connection options for improved performance.

Maximum Seated Height: 1.6 mm

Allows for low-profile installations, beneficial for modern compact devices.

RAM Words: 512

Sufficient memory capacity for handling multiple tasks and data processing efficiently.

Width: 14 mm

Compact width helps maintain space efficiency on circuit boards.

External Data Bus Width: 16

Provides high data throughput capabilities, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

Supports fast operational speeds, making it suitable for demanding applications.

Length: 14 mm

Compact length is ideal for devices with limited space while maintaining functionality.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial conditions, ensuring durability and reliability in critical applications.

ROM Bits Size: 1024 Bits

Provides adequate firmware storage, facilitating features and utility in various applications.

Technology: CMOS

Offers low power consumption while maintaining high performance, ideal for energy-sensitive applications.

Terminal Form: GULL WING

Provides robust mechanical and electrical connections, enhancing durability and reliability.

Nominal Supply Voltage: 5 V

Standard voltage operation simplifies integration with existing systems.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Versatile compatibility with various buses enhances integration into diverse applications.

Terminal Pitch: 0.65 mm

Allows for densely packed components, optimizing space on circuit boards.

Maximum Standby Current: 0.00002 Amp

Very low standby current increases energy efficiency and extends device lifecycle.

Maximum Access Time: 0.00000009 ns

Supports extremely fast operations, optimizing performance in high-speed applications.

No. of I/O Lines: 40

Provides enhanced input/output options for flexible connectivity and functionality.

Technical Specifications

Multi-functional Peripherals ZPSD503B1-90UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD503B1-90UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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