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CY8C5866LTI-LP022

Infineon Technologies

CY8C5866LTI-LP022 by Infineon Technologies

CY8C5866LTI-LP022 by Infineon is a 68-terminal chip carrier with 16K RAM, 524288 ROM bits, and 33 MHz clock frequency. Ideal for industrial applications, it supports I2C, USB, and PS/2 bus compatibility. With a temperature range of -40 to 85 °C, this CMOS technology device is boundary scan enabled.

Median Price

$14.175

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,439 parts In-Stock

1+ parts

$12.670

100+ parts

-

1k+ parts

-

10k+ parts

-

2,439

$12.670

-

-

-

Chip1Stop

Japan . 2,055 parts In-Stock

1+ parts

$14.810

100+ parts

-

1k+ parts

-

10k+ parts

-

2,055

$14.810

-

-

-

Verical

USA . 2,264 parts In-Stock

1+ parts

-

100+ parts

$16.925

1k+ parts

$15.137

10k+ parts

$14.250

2,264

-

$16.925

$15.137

$14.250

Rochester

USA . 2,264 parts In-Stock

1+ parts

-

100+ parts

$13.540

1k+ parts

$12.110

10k+ parts

$11.400

2,264

-

$13.540

$12.110

$11.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 50 parts In-Stock

1+ parts

$13.110

100+ parts

-

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10k+ parts

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50

$13.110

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$31.660

100+ parts

-

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-

10k+ parts

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100

$31.660

-

-

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Flip Electronics

USA . 2,588 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,588

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-

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Vyrian

USA . 1,973 parts In-Stock

1+ parts

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1,973

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,042 parts In-Stock

1+ parts

$11.730

100+ parts

$11.437

1k+ parts

$11.378

10k+ parts

-

2,042

$11.730

$11.437

$11.378

-

Ampacity Inc.

Singapore . 1,919 parts In-Stock

1+ parts

$11.730

100+ parts

-

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1,919

$11.730

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Corphita

USA . 518 parts In-Stock

1+ parts

$12.420

100+ parts

-

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518

$12.420

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Component Stockers USA

USA . 5,959 parts In-Stock

1+ parts

$24.220

100+ parts

$24.220

1k+ parts

$24.220

10k+ parts

-

5,959

$24.220

$24.220

$24.220

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$31.027

100+ parts

-

1k+ parts

$29.786

10k+ parts

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1,000

$31.027

-

$29.786

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Aztec Data Supply Inc.

USA . 2,365 parts In-Stock

1+ parts

$31.592

100+ parts

-

1k+ parts

-

10k+ parts

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2,365

$31.592

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Continental Prestige Electronics

USA . 5,692 parts In-Stock

1+ parts

$31.660

100+ parts

-

1k+ parts

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10k+ parts

$31.027

5,692

$31.660

-

-

$31.027

Microchip USA

USA . 1,270 parts In-Stock

1+ parts

$40.432

100+ parts

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10k+ parts

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1,270

$40.432

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Modulus Dynamics

Lithuania . 1,144 parts In-Stock

1+ parts

$42.758

100+ parts

$41.048

1k+ parts

$39.337

10k+ parts

-

1,144

$42.758

$41.048

$39.337

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Corohmni

South Africa . 2,612 parts In-Stock

1+ parts

$54.783

100+ parts

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2,612

$54.783

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Argo Parts USA

USA . 3,152 parts In-Stock

1+ parts

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3,152

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Perfect Parts

USA . 62 parts In-Stock

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62

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Overview

Unlock endless possibilities with the CY8C5866LTI-LP022 from Infineon Technologies. This multi-functional peripheral boasts top-notch quality and reliability, making it the go-to choice for a wide range of applications. With its innovative technology and advanced features, this product offers unparalleled value and benefits to customers. Experience seamless performance and unmatched efficiency with the CY8C5866LTI-LP022, setting new standards in the industry.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on circuit boards, making this product convenient for use in various applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility and compatibility.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and allowing for easy integration into different system layouts.

Power Supplies (V): 2/5

The dual power supply options allow for flexibility in power management, catering to different power requirements in various settings.

No. of Terminals: 68

With a large number of terminals, this product offers ample connectivity options, enabling seamless integration with other devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures efficient heat dissipation and a slim profile, enhancing the product's performance and space-saving capabilities.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources, making this product cost-effective and versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments, making this product suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity and corrosion resistance, ensuring long-lasting and reliable connections for the product.

Ultraviolet Erasable: N

The non-UV erasable feature provides data security and stability, making this product a reliable choice for storing important information.

Terminal Position: QUAD

The quad terminal position offers increased connectivity options and flexibility, allowing for easy integration into different systems and configurations.

Technical Specifications

Multi-functional Peripherals CY8C5866LTI-LP022 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

16K

ROM Bits Size:

524288 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C5866LTI-LP022 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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