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CY8C3866LTI-030

Infineon Technologies

CY8C3866LTI-030 by Infineon Technologies

CY8C3866LTI-030 by Infineon: 5.5V max supply, 67MHz clock, 4096 RAM words. Ideal for industrial applications with -40 to 85 °C operating temp range and 48 I/O lines.

Median Price

$15.639

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 7 parts In-Stock

1+ parts

$11.930

100+ parts

-

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7

$11.930

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Avnet

USA . 5,980 parts In-Stock

1+ parts

$11.969

100+ parts

$11.360

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-

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5,980

$11.969

$11.360

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Arrow

USA . 278 parts In-Stock

1+ parts

$15.290

100+ parts

$13.000

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-

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278

$15.290

$13.000

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DigiKey

USA . 883 parts In-Stock

1+ parts

$21.530

100+ parts

$14.962

1k+ parts

$14.041

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883

$21.530

$14.962

$14.041

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Mouser Electronics

USA . 824 parts In-Stock

1+ parts

$21.530

100+ parts

$14.970

1k+ parts

$14.050

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-

824

$21.530

$14.970

$14.050

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Chip1Stop

Japan . 60 parts In-Stock

1+ parts

$24.700

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60

$24.700

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Element14

Singapore . 7 parts In-Stock

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$25.140

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7

$25.140

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Rochester

USA . 3,682 parts In-Stock

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-

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$12.790

1k+ parts

$11.440

10k+ parts

$10.770

3,682

-

$12.790

$11.440

$10.770

Verical

USA . 3,682 parts In-Stock

1+ parts

-

100+ parts

$15.988

1k+ parts

$14.300

10k+ parts

$13.463

3,682

-

$15.988

$14.300

$13.463

Future Electronics

Canada . 325 parts In-Stock

1+ parts

-

100+ parts

$11.780

1k+ parts

-

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325

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$11.780

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 277 parts In-Stock

1+ parts

$9.966

100+ parts

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277

$9.966

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Vyrian

USA . 699 parts In-Stock

1+ parts

$10.490

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$10.490

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Flip Electronics

USA . 1,656 parts In-Stock

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1,656

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IBS Electronics

USA . 325 parts In-Stock

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100+ parts

$16.521

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325

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$16.521

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Nova Conductors

Japan . 78 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,809 parts In-Stock

1+ parts

$4.500

100+ parts

$4.320

1k+ parts

$4.140

10k+ parts

-

2,809

$4.500

$4.320

$4.140

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Corohmni

South Africa . 2,555 parts In-Stock

1+ parts

$4.500

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2,555

$4.500

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Corphita

USA . 141 parts In-Stock

1+ parts

$9.441

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141

$9.441

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$11.969

100+ parts

$10.892

1k+ parts

$9.815

10k+ parts

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50

$11.969

$10.892

$9.815

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Component Stockers USA

USA . 3,978 parts In-Stock

1+ parts

$13.960

100+ parts

$12.460

1k+ parts

$12.120

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3,978

$13.960

$12.460

$12.120

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Microchip USA

USA . 2,570 parts In-Stock

1+ parts

$47.679

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2,570

$47.679

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A-Z Elektronik GmbH

Germany . 6,897 parts In-Stock

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6,897

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Alle Elektronik GmbH

Germany . 4,598 parts In-Stock

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Argo Parts USA

USA . 4,075 parts In-Stock

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4,075

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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RC Electronics

USA . 3,420 parts In-Stock

1+ parts

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$12.430

1k+ parts

$11.720

10k+ parts

$11.480

3,420

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$12.430

$11.720

$11.480

Continental Prestige Electronics

USA . 1,458 parts In-Stock

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Perfect Parts

USA . 410 parts In-Stock

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410

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the CY8C3866LTI-030 by Infineon Technologies. This multi-functional peripheral boasts top-notch quality and reliability, perfect for a wide range of applications. With its advanced technology and innovative design, this product offers unparalleled value and benefits to customers looking for high-performance solutions. Say goodbye to limitations and hello to limitless opportunities with the CY8C3866LTI-030.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier assembly and smaller form factor, making this product ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different electrical systems.

Package Shape: SQUARE

The square package shape is efficient for component layout and allows for easier integration into circuit designs.

Power Supplies (V): 2/5

Dual power supply options provide flexibility in powering the device, allowing it to be compatible with a variety of voltage sources.

No. of Terminals: 68

With a large number of terminals, this product can accommodate multiple connections and functionalities, enhancing its versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact size, making this product suitable for high-performance applications in tight spaces.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows for operation in energy-efficient systems and extends the product's usability in low-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its durability and reliability.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the product can function in both extreme cold and hot conditions, making it suitable for various industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances the product's corrosion resistance and reliability in long-term usage.

Ultraviolet Erasable: N

Non-ultraviolet erasable technology simplifies the device's implementation and maintenance, reducing complexity for users.

Terminal Position: QUAD

Quad terminal position allows for efficient connectivity and signal transfer, optimizing the product's performance in multi-functional operations.

Maximum Seated Height: 1 mm

The low seated height of 1 mm enables a compact design and ease of integration into space-critical applications.

RAM Words: 4096

With a large RAM word capacity, this product can store and process a significant amount of data efficiently, enhancing its multi-functional capabilities.

Width: 8 mm

The narrow width of 8 mm allows for a slim and sleek design, enabling the product to be easily incorporated into various equipment and systems.

Boundary Scan: YES

Boundary scan technology facilitates testing and debugging of the product during manufacturing, improving quality control and overall product reliability.

Maximum Clock Frequency: 67 MHz

High clock frequency capability of 67 MHz enables fast data processing and communication, enhancing the product's performance in multi-functional tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient soldering and assembly processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C guarantees proper soldering and component integration, enhancing the product's durability and reliability.

Length: 8 mm

The short length of 8 mm contributes to a compact form factor, making the product space-efficient and easy to incorporate into diverse applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable and reliable operation in harsh industrial environments, making the product suitable for robust applications.

ROM Bits Size: 65536 Bits

Large ROM bits size of 65536 bits allows for extensive data storage and retrieval, enabling the product to support complex multi-functional tasks effectively.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the product's efficiency and reliability in multi-functional operations.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and ensures the product's sustainability, making it an eco-friendly choice for users.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with standard voltage requirements, simplifying integration into diverse systems.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm enables precise and compact connectivity, optimizing signal transfer and enhancing the product's functionality in multi-functional peripherals.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring standard precautions during handling and storage for prolonged product longevity.

No. of I/O Lines: 48

With 48 I/O lines, this product offers ample input/output connectivity for versatile interfacing with external devices and systems, enhancing its multi-functional capabilities.

Technical Specifications

Multi-functional Peripherals CY8C3866LTI-030 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

YES

Maximum Clock Frequency:

67 MHz

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.3SQ,40

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

4096

ROM Bits Size:

65536 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C3866LTI-030 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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