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LS1017AXE7PQA

NXP Semiconductors

LS1017AXE7PQA by NXP Semiconductors

LS1017AXE7PQA by NXP Semiconductors is a Multi-functional Peripheral IC with 32-bit External Data Bus, 262144 RAM Words, and 448 Terminals. It operates in Industrial Temperature Grade range (-40 to 105 °C) and supports I2C, SAI, SPI, UART bus compatibility. Ideal for applications requiring high-performance peripherals in compact form factors.

Median Price

$73.479

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,990 parts In-Stock

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$73.479

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9,990

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$73.479

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DigiKey

USA . 255 parts In-Stock

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Flip Electronics (Authorized)

USA . 255 parts In-Stock

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255

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Distributors (In-Stock)

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Nova Conductors

Japan . 800 parts In-Stock

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$65.023

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800

$65.023

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Vyrian

USA . 7,114 parts In-Stock

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Digiode

USA . 3,040 parts In-Stock

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Anansix

USA . 1,118 parts In-Stock

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Flip Electronics

USA . 255 parts In-Stock

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 232 parts In-Stock

1+ parts

$4.000

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$4.000

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AZTECH Wire

Italy . 586 parts In-Stock

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$19.252

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586

$19.252

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Corohmni

South Africa . 46 parts In-Stock

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$30.514

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Continental Prestige Electronics

USA . 1,590 parts In-Stock

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$65.023

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$63.723

1,590

$65.023

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$63.723

Netroflash

USA . 100 parts In-Stock

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$65.023

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100

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Microchip USA

USA . 9,192 parts In-Stock

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$156.567

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Corphita

USA . 1,224 parts In-Stock

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Argo Parts USA

USA . 258 parts In-Stock

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UNI Independent Distributors

Spain . 255 parts In-Stock

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Overview

Enhance your electronic devices with the LS1017AXE7PQA by NXP Semiconductors, a top-tier manufacturer known for delivering cutting-edge innovations in the Multi-functional Peripherals category. This high-quality product offers customers unparalleled value and benefits, providing seamless integration and superior performance that exceed expectations. Elevate your projects with the LS1017AXE7PQA and experience the advantages of advanced technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this multi-functional peripheral lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various devices or systems.

Maximum Supply Voltage: 1.03 V

With a high maximum supply voltage, this multi-functional peripheral can handle demanding tasks without voltage issues.

Address Bus Width: 14

The wide address bus width of 14 allows for efficient communication within the peripheral, enhancing overall performance.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space in the application where the peripheral is used.

No. of Terminals: 448

The large number of terminals offers versatility and connectivity options for a wide range of devices or systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style ensures secure connections and reliable performance in the most demanding environments.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage makes this multi-functional peripheral energy-efficient and cost-effective to operate.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this peripheral can withstand heat and perform reliably in harsh conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the peripheral to function effectively even in extremely cold environments.

Terminal Position: BOTTOM

The terminal position at the bottom of the peripheral ensures easy and convenient access for connectivity and maintenance.

Maximum Seated Height: 2.61 mm

The maximum seated height of 2.61 mm offers a slim profile, making this peripheral suitable for compact designs.

RAM Words: 262144

The large RAM capacity of 262144 words enables efficient data storage and retrieval for seamless multitasking.

Width: 17 mm

The compact width of 17 mm allows for easy integration into space-constrained devices or systems.

Boundary Scan: YES

The boundary scan feature provides enhanced testing and troubleshooting capabilities for improved reliability and performance.

External Data Bus Width: 32

The wide external data bus width of 32 enhances data transfer speeds and overall system efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

The short maximum time at peak reflow temperature of 40 seconds ensures quick and reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure solder joints for long-lasting performance.

Length: 17 mm

The compact length of 17 mm makes this peripheral suitable for space-saving designs without compromising functionality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in challenging environments with fluctuating temperatures.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

The multifunction peripheral IC type offers versatile functionality, making it a versatile choice for various applications.

Technology: CMOS

The CMOS technology used in this peripheral provides efficient power consumption and high-speed processing capabilities.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections for seamless integration into devices or systems.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1V provides stable power delivery for consistent performance.

No. of Serial I/Os: 8

The 8 serial I/Os offer versatile connectivity options for interfacing with other devices or systems.

Bus Compatibility: I2C, SAI, SPI, UART

The bus compatibility with I2C, SAI, SPI, and UART allows for seamless integration and communication with a wide range of devices.

Terminal Pitch: 0.75 mm

The terminal pitch of 0.75 mm provides compact spacing for efficient connections and space-saving designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures safe handling and storage to prevent damage from humidity.

No. of I/O Lines: 68

The 68 I/O lines offer ample connectivity options for interfacing with external devices or systems.

Technical Specifications

Multi-functional Peripherals LS1017AXE7PQA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, SAI, SPI, UART

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B448

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Serial I/Os:

8

No. of Terminals:

448

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA448,30X30,30

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

262144

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LS1017AXE7PQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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