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LS1026ASE8T1A

NXP Semiconductors

LS1026ASE8T1A by NXP Semiconductors

LS1026ASE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact grid array package style.

Median Price

$104.125

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,960 parts In-Stock

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Vyrian

USA . 7,977 parts In-Stock

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Anansix

USA . 1,381 parts In-Stock

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Digiode

USA . 275 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Flip Electronics

USA . 23 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 481 parts In-Stock

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$4.000

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481

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AZTECH Wire

Italy . 367 parts In-Stock

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$18.830

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367

$18.830

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Ampacity Inc.

Singapore . 1,483 parts In-Stock

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$29.000

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Aztec Data Supply Inc.

USA . 2,837 parts In-Stock

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$72.016

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Corohmni

South Africa . 20 parts In-Stock

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$78.493

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20

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Vigor

Singapore . 7,602 parts In-Stock

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$132.360

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Microchip USA

USA . 1,742 parts In-Stock

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$153.777

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UNI Independent Distributors

Spain . 6,413 parts In-Stock

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Continental Prestige Electronics

USA . 5,420 parts In-Stock

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Argo Parts USA

USA . 2,233 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 757 parts In-Stock

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Overview

Elevate your electronic designs with the LS1026ASE8T1A by NXP Semiconductors, a high-quality multi-functional peripheral that offers unmatched versatility and performance. Developed by industry-leading manufacturer NXP Semiconductors, this product is perfect for a wide range of applications, from consumer electronics to industrial automation. With its innovative technology and cutting-edge features, the LS1026ASE8T1A delivers exceptional value and benefits to customers, making it an essential component for any project. Experience the advantages of superior quality and reliability with this top-of-the-line semiconductor solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space and making installation easier.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable and reliable operation of the device.

Address Bus Width: 14

A wide address bus width allows for efficient data transfer and processing.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring optimal performance.

Width: 23 mm

The compact width of the product makes it suitable for use in various settings and configurations.

External Data Bus Width: 64

A wide external data bus width allows for high-speed data transfer and processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Bus Compatibility: I2C, PCI, SPI, UART, USB

Compatibility with multiple bus interfaces allows for versatile connectivity options and integration with various systems.

Technical Specifications

Multi-functional Peripherals LS1026ASE8T1A attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, PCI, SPI, UART, USB

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

LS1026ASE8T1A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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