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PSD513B1-70LI

STMicroelectronics

PSD513B1-70LI by STMicroelectronics

PSD513B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 5.5V, 1024 RAM words, and operates at up to 36 MHz. It’s ideal for industrial applications due to its wide temp range (-40 °C to 85°C). This chip carrier design supports various bus types for enhanced compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,980 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,980

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Vyrian

USA . 4,030 parts In-Stock

1+ parts

-

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1k+ parts

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4,030

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Anansix

USA . 2,599 parts In-Stock

1+ parts

-

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2,599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 563 parts In-Stock

1+ parts

$31.266

100+ parts

-

1k+ parts

$28.140

10k+ parts

-

563

$31.266

-

$28.140

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MKK Technologies

India . 1,974 parts In-Stock

1+ parts

$58.794

100+ parts

-

1k+ parts

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10k+ parts

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1,974

$58.794

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DigiPath Technology Company

USA . 1,974 parts In-Stock

1+ parts

$58.794

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

$58.794

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Corohmni

South Africa . 237 parts In-Stock

1+ parts

$76.179

100+ parts

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237

$76.179

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Corphita

USA . 2,815 parts In-Stock

1+ parts

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2,815

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Parana Technologies

USA . 1,656 parts In-Stock

1+ parts

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100+ parts

$37.384

1k+ parts

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10k+ parts

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1,656

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$37.384

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Overview

Experience unparalleled performance with the PSD513B1-70LI from STMicroelectronics, a leader in innovative technology solutions. Designed for reliability and versatility, this multi-functional peripheral excels in various industrial applications, ensuring smooth operation in demanding environments. With its robust build and efficient power management, it empowers your projects to achieve greater efficiency and longevity. Elevate your designs with a trusted component that delivers exceptional value and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction provides excellent reliability and protection against environmental factors, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, facilitating easier integration into various systems.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage offers flexibility in power management, accommodating a variety of system requirements.

Address Bus Width: 16

With a 16-bit address bus width, this product can access a larger memory space, enhancing its data handling capabilities.

Package Shape: SQUARE

The square package shape optimizes space usage on printed circuit boards, making it efficient for multi-functional peripherals.

No. of Terminals: 68

The 68 terminals provide ample connection points for I/O lines and other functionalities, ensuring versatility in application.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with a window allows for easy visual inspection, enhancing maintenance and troubleshooting.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, the product supports lower power consumption applications, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C ensures reliability in high-temperature settings, making it ideal for industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate in extreme cold (-40 °C) qualifies this product for use in harsh weather conditions.

Terminal Position: QUAD

Quad terminal position allows for easy access and efficient layout on circuit boards, enhancing design flexibility.

Maximum Seated Height: 4.57 mm

A low seated height facilitates compact designs, making it ideal for space-constrained applications.

RAM Words: 1024

The 1024 RAM words capacity enhances data processing capabilities, allowing for efficient operation in multi-functional tasks.

Width: 24.105 mm

This width is optimal for balanced design, allowing for effective heat dissipation and circuit layout.

External Data Bus Width: 8

An 8-bit external data bus width allows for faster data transfers, improving overall system performance.

Maximum Clock Frequency: 36 MHz

With a maximum clock frequency of 36 MHz, this product can process data quickly, making it suitable for demanding applications.

Length: 24.105 mm

The overall length promotes compactness while ensuring adequate space for connectivity.

Temperature Grade: INDUSTRIAL

Industrial temperature grading means robust performance in various environmental conditions, ideal for industrial settings.

Technology: CMOS

CMOS technology allows for low power consumption and high integration, making the product energy-efficient and capable of complex functionalities.

Terminal Form: J BEND

J-bend terminal form ensures secure connections, reducing the risk of disconnections in dynamic environments.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with widespread electronic standards, allowing for easy system compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility enhances system integration capabilities, making this product adaptable across various platforms.

Terminal Pitch: 1.27 mm

A standard 1.27 mm terminal pitch allows for compatibility with most circuit designs, simplifying assembly and replacement.

No. of I/O Lines: 40

With 40 I/O lines available, this product supports a wide array of input and output configurations, boosting its versatility.

Technical Specifications

Multi-functional Peripherals PSD513B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD513B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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