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CY8C5866AXI-LP021

Infineon Technologies

CY8C5866AXI-LP021 by Infineon Technologies

CY8C5866AXI-LP021 by Infineon is a multi-functional peripheral with 5.5V max supply voltage, 33MHz clock frequency, and 72 I/O lines. Ideal for industrial applications, it features a CMOS technology, operates b/w -40 to 85 °C, and supports I2C, USB, PS/2 bus compatibility.

Median Price

$36.753

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 377 parts In-Stock

1+ parts

-

100+ parts

$34.110

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377

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$34.110

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Flip Electronics (Authorized)

USA . 377 parts In-Stock

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377

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Verical

USA . 377 parts In-Stock

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$39.396

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377

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$39.396

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$22.462

100+ parts

-

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74

$22.462

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Vyrian

USA . 821 parts In-Stock

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821

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Digiode

USA . 519 parts In-Stock

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519

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Flip Electronics

USA . 377 parts In-Stock

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377

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DigiKey Marketplace

USA . 377 parts In-Stock

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377

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 2,037 parts In-Stock

1+ parts

$12.910

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2,037

$12.910

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AZTECH Wire

Italy . 821 parts In-Stock

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$13.598

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821

$13.598

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Continental Prestige Electronics

USA . 5,348 parts In-Stock

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$22.462

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$22.013

5,348

$22.462

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$22.013

Netroflash

USA . 1,000 parts In-Stock

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$22.462

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1,000

$22.462

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Semicontronic

India . 221 parts In-Stock

1+ parts

$28.990

100+ parts

$28.265

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$28.120

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221

$28.990

$28.265

$28.120

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Ampacity Inc.

Singapore . 49 parts In-Stock

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$28.990

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49

$28.990

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Microchip USA

USA . 1,974 parts In-Stock

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$48.605

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$48.605

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Corohmni

South Africa . 2,636 parts In-Stock

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$62.145

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2,636

$62.145

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Modulus Dynamics

Lithuania . 2,742 parts In-Stock

1+ parts

$86.721

100+ parts

$83.252

1k+ parts

$79.783

10k+ parts

-

2,742

$86.721

$83.252

$79.783

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Argo Parts USA

USA . 2,973 parts In-Stock

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2,973

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 176 parts In-Stock

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176

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Corphita

USA . 143 parts In-Stock

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143

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Overview

Unlock the potential of your next project with the CY8C5866AXI-LP021 from Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability. This multi-functional peripheral is versatile, offering a wide range of applications to suit your needs. With its innovative features and advanced technology, this product brings unmatched value and benefits to customers. Experience seamless performance and enhanced functionality with the CY8C5866AXI-LP021, setting new standards in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product long-lasting and easy to transport.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources, making the product versatile in different settings.

Minimum Operating Temperature: -40 °C

Can function in extreme cold conditions, ensuring reliability in various environments.

RAM Words: 8192

Sufficient RAM capacity for handling complex tasks and multitasking efficiently.

Technology: CMOS

Utilizes advanced CMOS technology for power efficiency and performance optimization.

Technical Specifications

Multi-functional Peripherals CY8C5866AXI-LP021 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

72

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Words:

8192

ROM Bits Size:

524288 Bits

Maximum Seated Height:

1.6 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

CY8C5866AXI-LP021 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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