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TDA3MASBABFQ1

Texas Instruments

TDA3MASBABFQ1 by Texas Instruments

TDA3MASBABFQ1 by Texas Instruments is a multi-functional peripheral IC with 32-bit external data bus width, 38.4 MHz max clock frequency, and 524288 RAM words. Ideal for automotive applications, it supports CAN(2), I2C(2), QSPI, SPI(4), UART(3) bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,464 parts In-Stock

1+ parts

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3,464

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Vyrian

USA . 3,128 parts In-Stock

1+ parts

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3,128

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 637 parts In-Stock

1+ parts

$3.000

100+ parts

-

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637

$3.000

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AZTECH Wire

Italy . 748 parts In-Stock

1+ parts

$10.562

100+ parts

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748

$10.562

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Parana Technologies

USA . 1,160 parts In-Stock

1+ parts

$13.225

100+ parts

-

1k+ parts

$13.731

10k+ parts

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1,160

$13.225

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$13.731

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ChromeModa Solutions

Germany . 3,160 parts In-Stock

1+ parts

$14.860

100+ parts

$12.185

1k+ parts

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10k+ parts

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3,160

$14.860

$12.185

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IDEA Electronic Components Group

UK . 1,797 parts In-Stock

1+ parts

$14.860

100+ parts

$14.117

1k+ parts

$13.374

10k+ parts

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1,797

$14.860

$14.117

$13.374

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Corohmni

South Africa . 3,240 parts In-Stock

1+ parts

$19.458

100+ parts

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10k+ parts

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3,240

$19.458

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DigiPath Technology Company

USA . 1,941 parts In-Stock

1+ parts

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100+ parts

$13.398

1k+ parts

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1,941

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$13.398

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Corphita

USA . 185 parts In-Stock

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185

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Overview

Unleash the power of cutting-edge technology with the TDA3MASBABFQ1 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability with their multi-functional peripherals. Whether you're looking to enhance automotive systems or optimize industrial machinery, this product offers unmatched value, benefits, and advantages. Join countless satisfied customers who have experienced the superior performance and innovation that Texas Instruments brings to the table. Elevate your projects to new heights with the TDA3MASBABFQ1 - the ultimate solution for all your technology needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and heat resistance, making the product suitable for long-term usage in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto PCBs, ensuring seamless integration and space-saving design.

Maximum Supply Voltage: 1.11 V

High maximum supply voltage ensures stable performance and prevents any potential damage to the product during operation.

Address Bus Width: 16

Wide address bus width enables efficient communication between components, enhancing the overall functionality and speed of the product.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards for automotive applications, making the product a reliable choice for automotive environments.

Package Shape: SQUARE

Square package shape allows for easy integration and efficient use of space, making the product suitable for compact designs.

No. of Terminals: 367

Large number of terminals provide extensive connectivity options, enabling versatile usage and compatibility with a wide range of systems.

Minimum Supply Voltage: 1.02 V

Low minimum supply voltage ensures energy efficiency and optimal power consumption, making the product cost-effective and environmentally friendly.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to withstand harsh environmental conditions and ensures reliable performance in various temperature ranges.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function in extreme cold conditions, making it suitable for a wide range of environments and applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly processes, ensuring easy integration and maintenance of the product.

Maximum Seated Height: 2.82 mm

Low maximum seated height allows for slim and compact product designs, saving space and enabling flexible mounting options.

RAM Words: 524288

Large RAM capacity enhances data processing and storage capabilities, enabling the product to handle complex tasks and applications effectively.

Width: 15 mm

Compact width dimensions make the product suitable for space-constrained applications and allow for versatile placement in various systems.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging processes, ensuring the product's reliability and ease of maintenance during operation.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer and efficient communication with external devices, enhancing the product's overall performance.

Maximum Clock Frequency: 38.4 MHz

High maximum clock frequency allows for fast data processing and smooth operation of the product, making it suitable for demanding applications that require real-time processing.

Length: 15 mm

Compact length dimensions make the product suitable for space-saving designs and enable flexible placement in various electronic systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable operation in automotive environments, making the product well-suited for automotive applications that require high durability and performance.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Multifunction peripheral IC type offers versatile functionality and compatibility with different systems, making the product a versatile and cost-effective choice for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and suitable for applications that require fast data processing.

Terminal Form: BALL

Ball terminal form enables reliable connections and secure mounting onto PCBs, ensuring the product's overall durability and longevity.

Nominal Supply Voltage: 1.06 V

Stable nominal supply voltage ensures consistent performance and reliability of the product, making it suitable for long-term use in various applications.

No. of Serial I/Os: 13

Multiple serial I/Os provide flexibility for connecting to various external devices and peripherals, enhancing the product's compatibility and functionality.

Bus Compatibility: CAN(2), I2C(2), QSPI, SPI(4), UART(3)

Wide bus compatibility ensures seamless integration with different communication protocols and systems, making the product versatile and suitable for various applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for dense packing and efficient use of space on PCBs, enabling compact designs and flexible placement options for the product.

No. of I/O Lines: 126

Large number of I/O lines provide extensive connectivity options and enhance the product's versatility and compatibility with different systems and peripherals.

Technical Specifications

Multi-functional Peripherals TDA3MASBABFQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN(2), I2C(2), QSPI, SPI(4), UART(3)

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B367

Length:

15 mm

No. of I/O Lines:

126

No. of Serial I/Os:

13

No. of Terminals:

367

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA367,22X22,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

RAM Words:

524288

Screening Level:

AEC-Q100

Maximum Seated Height:

2.82 mm

Maximum Supply Voltage:

1.11 V

Minimum Supply Voltage:

1.02 V

Nominal Supply Voltage:

1.06 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TDA3MASBABFQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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