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CC1111F8RSPR

Texas Instruments

CC1111F8RSPR by Texas Instruments

The Texas Instruments CC1111F8RSPR is a CMOS chip carrier with 36 terminals, 0.5mm pitch, and 0.9mm seated height. It features nickel palladium gold finish and can withstand peak reflow temperature of 260°C for up to 30s. Ideal for applications requiring multi-functional peripherals in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,871 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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9,871

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Digiode

USA . 1,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 658 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

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658

$5.000

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-

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Native Components

USA . 664 parts In-Stock

1+ parts

$11.701

100+ parts

-

1k+ parts

-

10k+ parts

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664

$11.701

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Northwest PG Solutions

USA . 1,389 parts In-Stock

1+ parts

$12.871

100+ parts

$11.584

1k+ parts

-

10k+ parts

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1,389

$12.871

$11.584

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AZTECH Wire

Italy . 696 parts In-Stock

1+ parts

$15.291

100+ parts

-

1k+ parts

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696

$15.291

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Corohmni

South Africa . 725 parts In-Stock

1+ parts

$18.132

100+ parts

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725

$18.132

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Parana Technologies

USA . 2,255 parts In-Stock

1+ parts

$27.575

100+ parts

-

1k+ parts

$37.500

10k+ parts

-

2,255

$27.575

-

$37.500

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DigiPath Technology Company

USA . 153 parts In-Stock

1+ parts

$30.363

100+ parts

$27.934

1k+ parts

-

10k+ parts

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153

$30.363

$27.934

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ChromeModa Solutions

Germany . 1,092 parts In-Stock

1+ parts

$30.983

100+ parts

$25.406

1k+ parts

-

10k+ parts

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1,092

$30.983

$25.406

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IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$30.983

100+ parts

$29.434

1k+ parts

$27.885

10k+ parts

-

60

$30.983

$29.434

$27.885

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Kepictronics

USA . 50,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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50,000

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Corphita

USA . 733 parts In-Stock

1+ parts

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733

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Overview

Elevate your projects with the CC1111F8RSPR by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality in their multi-functional peripherals. The CC1111F8RSPR is perfect for applications requiring reliability and high performance. With its surface mount design and advanced technology, this product offers unmatched value and benefits to customers. Say goodbye to limitations and experience the advantages of the CC1111F8RSPR in your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making the product more reliable and cost-effective.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and improving overall functionality.

No. of Terminals: 36

With a high number of terminals, this product offers a wide range of connectivity options for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures efficient heat dissipation and compact size.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: QUAD

The quad terminal position allows for easy placement and soldering, simplifying the manufacturing process.

Maximum Seated Height: 0.9 mm

The low maximum seated height enables a sleek and slim design for the product, suitable for space-constrained applications.

Width: 6 mm

The narrow width of 6mm ensures compatibility with various devices and equipment, offering flexibility in installation.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering, minimizing heat exposure to the components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering connections for optimal performance under different operating conditions.

Length: 6 mm

The compact length of 6mm further contributes to the space-saving design of the product, ideal for compact applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high efficiency, making it suitable for energy-efficient devices.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with regulations, making the product a sustainable choice.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm ensures precise connectivity and compatibility with modern electronic devices, enhancing performance.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during storage and handling, ensuring reliability.

Technical Specifications

Multi-functional Peripherals CC1111F8RSPR attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

36

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1111F8RSPR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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