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CC1111F32RSPR

Texas Instruments

CC1111F32RSPR by Texas Instruments

The Texas Instruments CC1111F32RSPR is a 8051 CPU with 4096 RAM Bytes. It operates b/w 0-85°C, has 21 I/O lines, and a terminal pitch of 0.5mm. This chip carrier with heat sink is ideal for multi-functional peripherals requiring low power consumption and compact design.

Median Price

$6.188

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,118 parts In-Stock

1+ parts

$6.136

100+ parts

$5.003

1k+ parts

$3.335

10k+ parts

-

11,118

$6.136

$5.003

$3.335

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DigiKey

USA . 2,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$6.240

2,734

-

-

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$6.240

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ozdisan Elektronik

Türkiye . 42 parts In-Stock

1+ parts

$4.394

100+ parts

-

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-

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42

$4.394

-

-

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Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$5.003

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-

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51

$5.003

-

-

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Digiode

USA . 310 parts In-Stock

1+ parts

$5.396

100+ parts

-

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310

$5.396

-

-

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Vyrian

USA . 6,528 parts In-Stock

1+ parts

-

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6,528

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Sensible Micro Corp

USA . 300 parts In-Stock

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300

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NAC Semi

USA . 34 parts In-Stock

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$12.540

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34

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$12.540

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PC Components Company LLC

USA . 20 parts In-Stock

1+ parts

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20

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Bristol Electronics

USA . 20 parts In-Stock

1+ parts

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20

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,398 parts In-Stock

1+ parts

$4.830

100+ parts

-

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-

10k+ parts

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6,398

$4.830

-

-

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Continental Prestige Electronics

USA . 4,469 parts In-Stock

1+ parts

$5.003

100+ parts

-

1k+ parts

-

10k+ parts

$4.902

4,469

$5.003

-

-

$4.902

Corphita

USA . 813 parts In-Stock

1+ parts

$5.112

100+ parts

-

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813

$5.112

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Corohmni

South Africa . 66 parts In-Stock

1+ parts

$5.140

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66

$5.140

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Semicontronic

India . 6,189 parts In-Stock

1+ parts

$5.220

100+ parts

$5.090

1k+ parts

$5.063

10k+ parts

-

6,189

$5.220

$5.090

$5.063

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Parana Technologies

USA . 204 parts In-Stock

1+ parts

$27.884

100+ parts

-

1k+ parts

$41.141

10k+ parts

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204

$27.884

-

$41.141

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DigiPath Technology Company

USA . 2,083 parts In-Stock

1+ parts

$30.703

100+ parts

$28.247

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2,083

$30.703

$28.247

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ChromeModa Solutions

Germany . 6,052 parts In-Stock

1+ parts

$31.330

100+ parts

$25.691

1k+ parts

-

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6,052

$31.330

$25.691

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IDEA Electronic Components Group

UK . 658 parts In-Stock

1+ parts

$31.330

100+ parts

$29.764

1k+ parts

$28.197

10k+ parts

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658

$31.330

$29.764

$28.197

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Kepictronics

USA . 50,000 parts In-Stock

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Perfect Parts

USA . 12,645 parts In-Stock

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12,645

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Metaverse IC Inc.

Canada . 12,300 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,242 parts In-Stock

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6,242

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QUARKTWIN TECHNOLOGY LTD

USA . 4,426 parts In-Stock

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4,426

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Alle Elektronik GmbH

Germany . 4,161 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 1,686 parts In-Stock

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1,686

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.902

1k+ parts

$4.752

10k+ parts

$4.652

500

-

$4.902

$4.752

$4.652

Authorized Procurement Solutions

USA . 42 parts In-Stock

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42

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GreenTree Electronics

Israel . 42 parts In-Stock

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42

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-

Overview

Unlock endless possibilities with the CC1111F32RSPR by Texas Instruments, a top-of-the-line multi-functional peripheral that guarantees superior quality and unmatched performance. From its innovative design to its state-of-the-art technology, this product is a game-changer in its category. Ideal for a wide range of applications, this chip carrier offers reliability and efficiency like no other. Say goodbye to limitations and hello to endless opportunities with the CC1111F32RSPR - the ultimate solution for all your needs. Elevate your projects to new heights with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, perfect for portable use.

Surface Mount: YES

Allows for easy installation without the need for through-holes, saving space and making assembly more efficient.

No. of Terminals: 36

Ample number of terminals for connectivity options and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliability and stability even under heavy usage.

CPU Family: 8051

Utilizes a proven and reliable CPU family for efficient processing and performance.

RAM Bytes: 4096

Sufficient RAM size for handling multitasking and data-intensive operations.

Technology: CMOS

CMOS technology offers low power consumption, ideal for energy-efficient devices.

Technical Specifications

Multi-functional Peripherals CC1111F32RSPR attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

CPU Family:

8051

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

21

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

4096

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1111F32RSPR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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