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STPCI2HEYC

STMicroelectronics

STPCI2HEYC by STMicroelectronics

STPCI2HEYC by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V, supporting USB and PCI bus compatibility. It features a 32-bit address bus width and operates at temperatures from 0 °C to 85°C. Ideal for compact applications, it comes in a square grid array package with 516 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,493 parts In-Stock

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8,493

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Anansix

USA . 2,459 parts In-Stock

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2,459

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Digiode

USA . 496 parts In-Stock

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496

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Electronics Depot

USA . 23 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$14.050

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817

$14.050

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Corohmni

South Africa . 1,970 parts In-Stock

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$46.737

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$46.737

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IDEA Electronic Components Group

UK . 97 parts In-Stock

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$48.317

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$43.486

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97

$48.317

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$43.486

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Microchip USA

USA . 389 parts In-Stock

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$50.617

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389

$50.617

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MKK Technologies

India . 764 parts In-Stock

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$90.858

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764

$90.858

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DigiPath Technology Company

USA . 764 parts In-Stock

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$90.858

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764

$90.858

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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Perfect Parts

USA . 3,044 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,574 parts In-Stock

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Corphita

USA . 993 parts In-Stock

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Parana Technologies

USA . 951 parts In-Stock

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$57.771

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951

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$57.771

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Overview

Unlock endless possibilities with the STPCI2HEYC from STMicroelectronics, a leader in cutting-edge technology. This versatile multi-functional peripheral is designed for reliability and performance, making it ideal for diverse applications like data communication and embedded systems. With its robust construction and compatibility across various buses, the STPCI2HEYC ensures seamless integration and exceptional value, empowering your projects with innovation and efficiency. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable PLASTIC/EPOXY material ensures longevity and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

The surface mount design allows for compact integration into diverse PCBs, optimizing space and improving performance.

Maximum Supply Voltage: 2.7 V

Operating with a maximum supply voltage of 2.7 V contributes to lower power consumption, making it suitable for energy-efficient applications.

Address Bus Width: 32

A 32-bit address bus width facilitates the handling of large amounts of data, enhancing the device's performance in data-intensive tasks.

Package Shape: SQUARE

The square package shape allows for ease of mounting on PCBs, which can improve thermal performance and overall efficiency.

Power Supplies (V): 2.5, 3.3

Support for dual power supply voltages provides versatility, allowing the device to be used in various applications.

No. of Terminals: 516

The high number of terminals enables multiple connections and functionalities, making this product suitable for complex use cases.

Package Style (Meter): GRID ARRAY

The grid array style allows for efficient thermal management and enhanced electrical performance, crucial for high-speed applications.

Minimum Supply Voltage: 2.45 V

With a minimum supply voltage of 2.45 V, this product can operate effectively in environments where power supply stability is variable.

Maximum Operating Temperature: 85 °C

The capability to operate up to 85 °C ensures reliability in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Starting operations at 0 °C allows for reliable functionality in diverse climates, enhancing application range.

Terminal Finish: TIN LEAD

The tin-lead finish on terminals provides excellent solderability, ensuring secure connections and greater longevity.

Terminal Position: BOTTOM

Bottom terminal positioning minimizes footprint and enhances the device's compatibility with various mounting configurations.

Maximum Seated Height: 2.38 mm

A compact seated height allows for space-saving designs in multi-functional peripherals without compromising performance.

Width: 35 mm

The width is optimized for standard enclosures, making integration into existing designs straightforward.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, saving time and costs in the development process.

External Data Bus Width: 32

With a 32-bit external data bus, this product supports high-speed data transmission, essential for modern multi-functional peripherals.

Maximum Clock Frequency: 14.31818 MHz

A maximum clock frequency of 14.31818 MHz allows for swift processing speeds, contributing to overall system efficiency.

Technology: CMOS

Employing CMOS technology results in low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal forms allow for effective heat dissipation and easier mounting, enhancing overall reliability.

Nominal Supply Voltage: 2.5 V

A nominal supply voltage of 2.5 V ensures optimal performance while maintaining energy efficiency across applications.

Bus Compatibility: USB; PCI; ISA; PCMCIA

Broad bus compatibility allows seamless integration with various systems, enhancing the product’s versatility and usability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch strikes a balance between compactness and accessibility, facilitating easier assembly on PCBs.

No. of I/O Lines: 24

With 24 I/O lines, this product supports multiple simultaneous operations, making it suitable for complex multi-functional tasks.

Technical Specifications

Multi-functional Peripherals STPCI2HEYC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; ISA; PCMCIA

Maximum Clock Frequency:

14.31818 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e0

Length:

35 mm

No. of I/O Lines:

24

No. of Terminals:

516

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCI2HEYC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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