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CY8C4248FNI-BL583T

Infineon Technologies

CY8C4248FNI-BL583T by Infineon Technologies

CY8C4248FNI-BL583T by Infineon is a versatile MCU with 48 MHz clock frequency, 16384 RAM words, and 36 I/O lines. Ideal for industrial applications, it supports I2C, I2S, SPI, UART, IRDA, LIN & IDE bus compatibility in a compact grid array package measuring 3.87mm x 4.04mm with a very thin profile of 0.55mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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J2 Sourcing AB

Sweden . 1,453 parts In-Stock

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Vyrian

USA . 715 parts In-Stock

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Digiode

USA . 149 parts In-Stock

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149

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Nova Conductors

Japan . 27 parts In-Stock

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Ampacity Inc.

Singapore . 988 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 883 parts In-Stock

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$8.005

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Semicontronic

India . 561 parts In-Stock

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$31.000

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$30.225

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$30.070

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$31.000

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$30.070

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Microchip USA

USA . 2,065 parts In-Stock

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$32.305

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Aztec Data Supply Inc.

USA . 1,012 parts In-Stock

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$44.080

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Corohmni

South Africa . 542 parts In-Stock

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$51.672

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$51.672

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Modulus Dynamics

Lithuania . 374 parts In-Stock

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$61.239

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$58.789

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$56.340

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Argo Parts USA

USA . 4,913 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 976 parts In-Stock

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Continental Prestige Electronics

USA . 617 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the Infineon Technologies CY8C4248FNI-BL583T, a versatile multi-functional peripheral offering cutting-edge technology and exceptional quality. Ideal for a wide range of applications, this product boasts a sleek design with 76 terminals and a maximum clock frequency of 48 MHz. With a nominal supply voltage of 3.3V and industrial-grade temperature tolerance, the CY8C4248FNI-BL583T delivers superior performance and reliability. Unlock endless possibilities and streamline your projects with this innovative solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle various power sources effectively.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy integration into existing setups.

No. of Terminals: 76

The large number of terminals provide versatility and compatibility with a wide range of devices.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to perform reliably in a wide range of environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extremely cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures high conductivity and corrosion resistance.

Terminal Position: BOTTOM

The terminal position at the bottom facilitates easy connections and efficient cable management.

Maximum Seated Height: 0.55 mm

The low maximum seated height allows for compact and slim design options.

RAM Words: 16384

With a large RAM capacity, this product can handle complex tasks and multitasking efficiently.

Width: 3.87 mm

The compact width makes this product suitable for space-constrained installations.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency enables fast data processing and high-speed performance.

Length: 4.04 mm

The short length of this product contributes to its overall compact and space-saving design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high speed.

Terminal Form: BALL

The ball terminal form provides strong connections and reliable signal transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is widely compatible and commonly used in various applications.

Bus Compatibility: I2C; I2S; SPI; UART; IRDA; LIN; IDE

The multiple bus compatibility options enable seamless integration with different systems and devices.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density connections and compact layout designs.

No. of I/O Lines: 36

The large number of I/O lines provides flexibility and versatility for connectivity and data transfer.

Technical Specifications

Multi-functional Peripherals CY8C4248FNI-BL583T attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

I2C; I2S; SPI; UART; IRDA; LIN; IDE

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B76

JESD-609 Code:

e4

Length:

4.04 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

36

No. of Terminals:

76

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

16384

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

3.87 mm

Trade Compliance

CY8C4248FNI-BL583T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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