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STPCI2EEYI

STMicroelectronics

STPCI2EEYI by STMicroelectronics

STPCI2EEYI by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 2.7V, supporting USB and PCI bus compatibility. It features a 32-bit address bus width and operates at temperatures from 0 °C to 70°C. Ideal for applications requiring efficient data transfer in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,426

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-

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Anansix

USA . 1,467 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

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-

-

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Digiode

USA . 397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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397

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 368 parts In-Stock

1+ parts

$14.681

100+ parts

-

1k+ parts

$13.213

10k+ parts

-

368

$14.681

-

$13.213

-

Corohmni

South Africa . 20 parts In-Stock

1+ parts

$23.347

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$23.347

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-

-

MKK Technologies

India . 863 parts In-Stock

1+ parts

$27.607

100+ parts

-

1k+ parts

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10k+ parts

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863

$27.607

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-

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DigiPath Technology Company

USA . 863 parts In-Stock

1+ parts

$27.607

100+ parts

-

1k+ parts

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10k+ parts

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863

$27.607

-

-

-

Parana Technologies

USA . 1,858 parts In-Stock

1+ parts

-

100+ parts

$17.554

1k+ parts

-

10k+ parts

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1,858

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$17.554

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Corphita

USA . 381 parts In-Stock

1+ parts

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381

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Overview

Unlock unparalleled performance and versatility with the STPCI2EEYI from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for multi-functional applications, this compact powerhouse delivers exceptional reliability and efficiency, ensuring your projects run smoothly. With robust compatibility across USB, PCI, and ISA buses, it’s perfect for everything from consumer electronics to industrial automation. Elevate your designs with the quality and expertise that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight properties, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on circuit boards.

Maximum Supply Voltage: 2.7 V

Supports low voltage operation, contributing to energy efficiency and reduced power consumption.

Address Bus Width: 32

A wider address bus allows for larger amounts of memory to be addressed, enhancing performance for data-intensive applications.

Package Shape: SQUARE

The square shape optimizes space on PCB layouts and provides balanced thermal and electrical performance.

Power Supplies (V): 2.5, 3.3

Dual voltage supply options provide flexibility in design and compatibility with various systems.

No. of Terminals: 516

A high number of terminals facilitates complex connections and enhanced functionality in multi-functional peripherals.

Package Style (Meter): GRID ARRAY

Grid array packages support high-density interconnections, ideal for advanced systems requiring multiple functionalities.

Minimum Supply Voltage: 2.45 V

Low minimum supply voltage enhances compatibility with a wider range of power supply options, ensuring reliable operation.

Maximum Operating Temperature: 70 °C

A high operating temperature range ensures reliability and performance under various thermal conditions.

Minimum Operating Temperature: 0 °C

Ensures operation in low-temperature environments, making the product suitable for diverse applications.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability and reliability in connections, enhancing the longevity of electronic assemblies.

Terminal Position: BOTTOM

Bottom terminal position allows for efficient use of space, enhancing the design possibilities on circuit boards.

Maximum Seated Height: 2.38 mm

Low seated height contributes to a compact design, which is crucial for space-constrained applications.

Width: 35 mm

Standard width allows for compatibility with common circuit board layouts and designs.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging, improving manufacturing efficiency and reliability.

External Data Bus Width: 32

A 32-bit external data bus enhances data throughput and performance for high-speed applications.

Maximum Clock Frequency: 14.318 MHz

A high clock frequency supports fast data processing, making the device suitable for demanding tasks.

Length: 35 mm

Standard length enhances ease of integration and layout in various applications.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance ensures reliable performance in standard operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making this product ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form enables reliable connections and efficient thermal management in compact designs.

Nominal Supply Voltage: 2.5 V

A nominal voltage of 2.5 V allows for optimal power consumption, enhancing efficiency in multi-functional use.

Bus Compatibility: USB; PCI; ISA

Broad bus compatibility ensures integration with various systems, enhancing versatility for diverse applications.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for efficient use of space and improves layout flexibility on PCBs.

No. of I/O Lines: 24

A generous number of I/O lines enables extensive connectivity options, making the device suitable for complex applications.

Technical Specifications

Multi-functional Peripherals STPCI2EEYI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

USB; PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e0

Length:

35 mm

No. of I/O Lines:

24

No. of Terminals:

516

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCI2EEYI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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