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ZPSD511B1-15J

STMicroelectronics

ZPSD511B1-15J by STMicroelectronics

ZPSD511B1-15J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words, supports various bus types, and is ideal for embedded applications. Its compact chip carrier design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,122 parts In-Stock

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4,122

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Digiode

USA . 2,124 parts In-Stock

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2,124

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Anansix

USA . 334 parts In-Stock

1+ parts

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334

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 644 parts In-Stock

1+ parts

$56.500

100+ parts

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1k+ parts

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644

$56.500

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IDEA Electronic Components Group

UK . 479 parts In-Stock

1+ parts

$66.806

100+ parts

-

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$60.125

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-

479

$66.806

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$60.125

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MKK Technologies

India . 859 parts In-Stock

1+ parts

$125.624

100+ parts

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859

$125.624

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DigiPath Technology Company

USA . 859 parts In-Stock

1+ parts

$125.624

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859

$125.624

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Parana Technologies

USA . 2,101 parts In-Stock

1+ parts

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100+ parts

$79.876

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2,101

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$79.876

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Corphita

USA . 1,233 parts In-Stock

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1,233

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Overview

Unlock the potential of your next project with the ZPSD511B1-15J from STMicroelectronics, a leading innovator in multi-functional peripherals. Designed with precision and reliability, this versatile solution enhances system performance while ensuring seamless integration across various applications. With robust support for multiple bus architectures and efficient power usage, it delivers exceptional value, empowering engineers to create smarter, more efficient designs. Elevate your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and ensures resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Being a surface mount device allows for high-density circuit design and enables better space utilization in modern electronic systems.

Maximum Supply Voltage: 5.5 V

This voltage range offers flexibility in integration with various power sources while ensuring safe operational limits.

Address Bus Width: 16

A 16-bit address bus width facilitates efficient memory addressing, allowing access to a large addressable memory space.

Package Shape: SQUARE

The square package shape simplifies PCB design and layout, enhancing overall product manufacturability.

Power Supplies (V): 5

Operating at 5V is standard for a variety of applications, making it compatible with a wide array of electronic circuits.

No. of Terminals: 68

With 68 terminals, this component supports numerous connections, enabling versatile interfacing options in complex circuits.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides robust mechanical support for the chip, enhancing reliability in critical applications.

Minimum Supply Voltage: 4.5 V

The low minimum voltage requirement allows operation in multiple environments, broadening its usability in various systems.

Maximum Operating Temperature: 70 °C

A high operational temperature rating indicates the component's ability to function reliably in demanding thermal conditions.

Minimum Operating Temperature: 0 °C

This ensures the device can operate in a wide range of environments, suitable for both indoor and outdoor applications.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability, ensuring secure and stable connections for long-term performance.

Ultraviolet Erasable: N

Not being ultraviolet erasable simplifies implementation, focusing on stable, non-volatile memory requirements for many applications.

Terminal Position: QUAD

Quad terminal positioning enables efficient layout design, assisting in achieving compact board designs.

Maximum Seated Height: 4.57 mm

The low profile allows for design flexibility in space-constrained applications, making it ideal for compact electronic devices.

RAM Words: 1024

A RAM capacity of 1024 words supports substantial data handling needs, making it suitable for sophisticated processing tasks.

Width: 24.18 mm

This width is standard for many multi-functional peripherals, making it easy to integrate into existing designs.

External Data Bus Width: 8

An 8-bit external data bus width simplifies data transfer and supports compatibility with various microcontrollers.

Maximum Clock Frequency: 34.48 MHz

High clock frequency enables faster processing speeds, contributing to improved performance in demanding applications.

Length: 24.18 mm

Like the width, this standard length enhances compatibility and simplifies integration into diverse electronic frameworks.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates suitability for everyday applications, meeting standard industrial requirements.

ROM Bits Size: 256 Bits

A ROM size of 256 bits provides sufficient capacity for essential program storage, supporting efficient operation of the peripheral.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: J BEND

J bend terminal form provides enhanced mechanical stability and ease of placement during assembly.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with most standard components in electronic devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

This extensive bus compatibility allows seamless integration with a wide range of microprocessors and systems.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch enhances compatibility with standard PCB layouts, ensuring easier assembly.

Maximum Standby Current: 0.00002 Amp

Very low standby current helps in power-saving applications, extending battery life for portable devices.

Maximum Access Time: 0.00000015 ns

The exceptionally fast access time enhances overall system performance, contributing to timely data processing.

No. of I/O Lines: 40

With 40 I/O lines, this product allows for extensive interfacing capabilities, suitable for complex applications.

Technical Specifications

Multi-functional Peripherals ZPSD511B1-15J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD511B1-15J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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