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CY8C4245LTI-M445

Infineon Technologies

CY8C4245LTI-M445 by Infineon Technologies

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HQCCN; Package Shape: SQUARE;

Median Price

$4.404

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 235 parts In-Stock

1+ parts

$3.690

100+ parts

-

1k+ parts

-

10k+ parts

-

235

$3.690

-

-

-

Arrow

USA . 235 parts In-Stock

1+ parts

$5.118

100+ parts

$3.316

1k+ parts

$2.994

10k+ parts

$2.789

235

$5.118

$3.316

$2.994

$2.789

DigiKey

USA . 295 parts In-Stock

1+ parts

$5.470

100+ parts

$3.501

1k+ parts

$3.225

10k+ parts

$3.055

295

$5.470

$3.501

$3.225

$3.055

Mouser Electronics

USA . 259 parts In-Stock

1+ parts

$5.470

100+ parts

$3.500

1k+ parts

$3.170

10k+ parts

$3.010

259

$5.470

$3.500

$3.170

$3.010

Rochester

USA . 1,807 parts In-Stock

1+ parts

-

100+ parts

$2.830

1k+ parts

$2.530

10k+ parts

$2.380

1,807

-

$2.830

$2.530

$2.380

Verical

USA . 1,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.163

10k+ parts

$2.975

1,807

-

-

$3.163

$2.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 200 parts In-Stock

1+ parts

$2.983

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$2.983

-

-

-

Vyrian

USA . 413 parts In-Stock

1+ parts

$3.140

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$3.140

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 488 parts In-Stock

1+ parts

$2.826

100+ parts

-

1k+ parts

-

10k+ parts

-

488

$2.826

-

-

-

Modulus Dynamics

Lithuania . 2,223 parts In-Stock

1+ parts

$67.703

100+ parts

$64.995

1k+ parts

$62.287

10k+ parts

-

2,223

$67.703

$64.995

$62.287

-

Corohmni

South Africa . 2,653 parts In-Stock

1+ parts

$71.826

100+ parts

-

1k+ parts

-

10k+ parts

-

2,653

$71.826

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 23,146 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,146

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Continental Prestige Electronics

USA . 3,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,723

-

-

-

-

Argo Parts USA

USA . 875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

875

-

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Technical Specifications

Multi-functional Peripherals CY8C4245LTI-M445 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

NO

Bus Compatibility:

I2C; SPI; UART; IRDA; IDE; LIN

Maximum Clock Frequency:

48 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

55

No. of Serial I/Os:

11

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

RAM Words:

2048

Maximum Seated Height:

1 mm

Maximum Supply Current:

13.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Peripheral IC Type:

Trade Compliance

CY8C4245LTI-M445 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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