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STPCV1KEBI

STMicroelectronics

STPCV1KEBI by STMicroelectronics

STPCV1KEBI by STMicroelectronics is a versatile multi-functional peripheral with a 32-bit address bus and operates at a max supply voltage of 3.6 V. It features industrial-grade temperature tolerance from -40 °C to 105 °C and supports boundary scan. Ideal for applications requiring reliable performance in compact designs, it comes in a square grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,695

-

-

-

-

Anansix

USA . 1,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,502

-

-

-

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Vyrian

USA . 1,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,197

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 159 parts In-Stock

1+ parts

$43.211

100+ parts

-

1k+ parts

$38.890

10k+ parts

-

159

$43.211

-

$38.890

-

MKK Technologies

India . 382 parts In-Stock

1+ parts

$81.255

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$81.255

-

-

-

DigiPath Technology Company

USA . 382 parts In-Stock

1+ parts

$81.255

100+ parts

-

1k+ parts

-

10k+ parts

-

382

$81.255

-

-

-

Corohmni

South Africa . 927 parts In-Stock

1+ parts

$82.145

100+ parts

-

1k+ parts

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10k+ parts

-

927

$82.145

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-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,000

-

-

-

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Corphita

USA . 3,726 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,726

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-

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Parana Technologies

USA . 868 parts In-Stock

1+ parts

-

100+ parts

$51.665

1k+ parts

-

10k+ parts

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868

-

$51.665

-

-

Overview

Unlock a world of innovation with the STPCV1KEBI by STMicroelectronics, a premier choice in multi-functional peripherals. Renowned for their commitment to quality and reliability, STMicroelectronics delivers unparalleled performance in diverse applications, from industrial automation to consumer electronics. With robust operating temperatures and advanced features, the STPCV1KEBI ensures efficiency and longevity, empowering your projects to thrive and adapt in today's dynamic environment. Elevate your designs with this exceptional component that combines value, versatility, and proven expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection against environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Being surface mount makes the product suitable for compact designs, allowing for space-efficient applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage applications.

Address Bus Width: 32

A 32-bit address bus width accommodates larger memory and data handling capabilities, enhancing overall performance.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, facilitating easier integration into various systems.

Power Supplies (V): 1.8, 3.3

The ability to operate on both 1.8 V and 3.3 V power supplies provides flexibility for various electronic designs.

No. of Terminals: 388

With 388 terminals, this product supports complex interconnections and functionalities, making it suitable for advanced applications.

Package Style (Meter): GRID ARRAY

Grid array packaging enhances thermal performance and enables better electrical connectivity in high-density layouts.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V ensures reliable operation in varying power environments.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature rating of 105 °C makes this product suitable for industrial environments where heat can be a concern.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures reliability in extreme cold conditions, making it suitable for outdoor and harsh applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability and helps maintain connections under various environmental stresses.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better routing and layout options on the PCB, optimizing space and connectivity.

Maximum Seated Height: 2.38 mm

A low seated height of 2.38 mm is beneficial for applications requiring slim profiles and compact designs.

Width: 35 mm

A standardized width of 35 mm facilitates easy integration within various electronic enclosures and systems.

Boundary Scan: YES

Boundary scan capability allows for easier testing and debugging of assembled PCBs, enhancing production efficiency.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transmission, improving performance in data-intensive applications.

Maximum Clock Frequency: 14.318 MHz

A maximum clock frequency of 14.318 MHz supports high-speed operations, making it suitable for demanding tasks.

Length: 35 mm

The length of 35 mm is consistent with PCB design standards, simplifying mounting and compatibility with various boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade signifies reliability and longevity under varying and harsh conditions typical in industrial applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form ensures robust electrical connections and better thermal management, enhancing overall product performance.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V strikes a balance between performance and power consumption in most applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is optimal for high-density designs, allowing for compact layouts without compromising performance.

Technical Specifications

Multi-functional Peripherals STPCV1KEBI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCV1KEBI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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